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Rocket PCB customized any-layer pcb layer

Rocket PCB customized any-layer pcb layer

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB customized any-layer pcb layer
Company Advantages
1. The aesthetic appearance of is achieved by using quality materials and the latest technologies. Its parts are spaced evenly and traces are symmetric and uniform
2. Rocket PCB Solution Ltd. has a full set of service system to ensure satisfaction of our customers. The product allows a high density among components
3. The product meets the international standards in all respects, such as performance, durability, usability, and so on. All the components within this product are fixed using solder flux


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB customized any-layer pcb layer-1





Rocket PCB customized any-layer pcb layer-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB customized any-layer pcb layer-3



Anylayer PCB DFM suggestion for layout


Rocket PCB customized any-layer pcb layer-4

Rocket PCB customized any-layer pcb layer-5



Product FEATURES


Rocket PCB customized any-layer pcb layer-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


Rocket PCB customized any-layer pcb layer-7                
Consumer electronics
Rocket PCB customized any-layer pcb layer-8                
Automotive electronics
Rocket PCB customized any-layer pcb layer-9                
Communications
Rocket PCB customized any-layer pcb layer-10                
Energy
Rocket PCB customized any-layer pcb layer-11                
Industrial & Instrumentation
Rocket PCB customized any-layer pcb layer-12                
IOT/Smart Home
Rocket PCB customized any-layer pcb layer-13                
Medical electronics
Rocket PCB customized any-layer pcb layer-14                
Security Industry

Company Features
1. We have invested in a series of advanced manufacturing facilities. These machines are equipped with the latest production technologies, which can ensure that we can manufacture our products at the highest level.
2. We are responsible for the environment. We partner with a range of organizations that are creating meaningful change for the environment.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!