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Rocket PCB customized any-layer pcb for wholesale

Rocket PCB customized any-layer pcb for wholesale

10 layer ELIC printed circuit board, any layer PCB fabrication
Board thickness:
Surface treatment:
Immersion Gold
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
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Product Information of Rocket PCB customized any-layer pcb for wholesale
Application Scope
As one of Rocket PCB's main products, PCB prototype has wide applications. It is mainly used in the following aspects.Rocket PCB always focuses on meeting customers' needs. We are dedicated to providing customers with comprehensive and quality solutions.
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Product Comparison
PCB maker, manufactured based on high-quality materials and advanced technology, has excellent quality and favorable price. It is a trustworthy product which receives recognition and support in the market.Rocket PCB's PCB maker has the following advantages over other similar products.
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Company Advantages
1. In order to follow the trends, Rocket PCB Solution Ltd. adopts the novel design for any-layer pcb .
2. This product will not go out of shape. It can securely lay in the shoe and keep its original shape, delivering reliable support for a long time.
3. This product is known for its abrasion resistance. Its fabrics are able to withstand the loss of appearance through surface wear, rubbing, chafing, and other frictional actions.
4. Rocket PCB is dedicated to producing any-layer pcb complying with the industry standard.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Rocket PCB customized any-layer pcb for wholesale-2

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%


ROCKET PCB Any Layer PCB (ELIC)process flow

Rocket PCB customized any-layer pcb for wholesale-3

Anylayer PCB DFM suggestion for layout

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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

The technology of making any layer HDI is summarized as follows

1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.


With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.

Product application

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Consumer electronics
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Automotive electronics
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. excels in dual layer pcb designing, manufacturing, and marketing. We have earned our reputation as one of the leading manufacturers in the industry.
2. Rocket PCB Solution Ltd. relies on a specialized R&D team to bring new technologies to any-layer pcb industry.
3. We adhere to the principle of integrity-orientation. We pledge to do fair trade and refuse to falsely advertise our products. We believe this will help us win clients' trust. We take pride in using low-impact manufacturing processes to create products that safeguard our food and water, lower dependence on energy, and enhance green initiatives. We think highly of service-orientation. We attach importance to long-term business cooperations with clients and we'll spare no efforts to offer them professional guidance and advice. We are committed to the core idea of "customer-center". We will wholeheartedly serve every customer and strive to offer them worthy solutions and services.
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