Rocket PCB  > 

AI - Page Sitemap

 > 

Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device

Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device

Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Details
Next, Rocket PCB will present you with the specific details of PCB prototyping.Rocket PCB has great production capability and excellent technology. We also have comprehensive production and quality inspection equipment. PCB prototyping has fine workmanship, high quality, reasonable price, good appearance, and great practicality.
Company Advantages
1. The design of wire bonding technology meets modern tendency.
2. The product features a sleek and smooth surface. It is refined with high-quality coating makes the color of the surface vivid and long-lasting.
3. The product has a translucent and smooth glaze surface which makes it stand out immediately. The clay used in it is fired at more than 2300 degrees Fahrenheit to help the white color show prominently.
4. Soft, silky and sensual, this product is a must for romantic or sexy bedrooms. People can choose this if they want maximum luxury.
5. With its user-friendly and advanced technology, the product is able to greatly improve people's overall efficiency of life or work.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-1


methods


Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-3



Product application


Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-4                
Consumer electronics
Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-5                
Automotive electronics
Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-6                
Communications
Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-7                
Energy
Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-8                
Industrial & Instrumentation
Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-9                
IOT/Smart Home
Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-10                
Medical electronics
Rocket PCB bonding aluminum wire bonding process bulk fabrication for digital device-11                
Security Industry

Company Features
1. Our high quality wire bonding technology is widely accepted in the global market.
2. Rocket PCB Solution Ltd. has an expert R&D team, a management team, and an application service team. Its ability to innovate can surely lead the wire bonding industry.
3. People can observe our company's commitment to social responsibility through our business activities. We constantly lower the carbon footprint and engage in fair trade, so as to reduce environmental impact and lower costs and increase profits. Get info! Rocket PCB Solution Ltd. is dedicated to meeting your particular service needs. Get info! Our mission is to build long-term cooperative relationships with our customers by providing them exceptional customer services, innovative products, and advanced technology. Get info! We constantly maintain strict environmental and sustainability standards at our factories and throughout every stage of our manufacturing process so that we protect the Earth and our customers.
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!