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Rocket PCB at discount pcb manufacturing process layer for wholesale

Rocket PCB at discount pcb manufacturing process layer for wholesale

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB at discount pcb manufacturing process layer for wholesale
Enterprise Strength
  • Meeting customers' needs is Rocket PCB's duty. The comprehensive service system is established to provide customers with personalized services and to improve their satisfaction.
Product Comparison
HDI PCB is in line with the stringent quality standards. The price is more favorable than other products in the industry and the cost performance is relatively high.Rocket PCB's HDI PCB has more advantages over similar products in terms of technology and quality.
Company Advantages
1. Rocket PCB pcb prototyping has a unique design. Various environmental, social, functional, and contextual considerations have worked on its design to inform the expression of this product.
2. The pen for this product includes a pressure detection system. As with a pencil, applying more pressure leaves a darker line, while less pressure makes a lighter one.
3. The product has a great future in this realm because of its remarkable economic return.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB at discount pcb manufacturing process layer for wholesale-1





Rocket PCB at discount pcb manufacturing process layer for wholesale-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB at discount pcb manufacturing process layer for wholesale-3



Anylayer PCB DFM suggestion for layout


Rocket PCB at discount pcb manufacturing process layer for wholesale-4

Rocket PCB at discount pcb manufacturing process layer for wholesale-5



Product FEATURES


Rocket PCB at discount pcb manufacturing process layer for wholesale-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


Rocket PCB at discount pcb manufacturing process layer for wholesale-7                
Consumer electronics
Rocket PCB at discount pcb manufacturing process layer for wholesale-8                
Automotive electronics
Rocket PCB at discount pcb manufacturing process layer for wholesale-9                
Communications
Rocket PCB at discount pcb manufacturing process layer for wholesale-10                
Energy
Rocket PCB at discount pcb manufacturing process layer for wholesale-11                
Industrial & Instrumentation
Rocket PCB at discount pcb manufacturing process layer for wholesale-12                
IOT/Smart Home
Rocket PCB at discount pcb manufacturing process layer for wholesale-13                
Medical electronics
Rocket PCB at discount pcb manufacturing process layer for wholesale-14                
Security Industry

Company Features
1. The focus on innovation enables Rocket PCB to be the leader in the pcb manufacturing process industry absolutely.
2. We have assembled a group of exceptionally talented people who represent our unique capabilities in this technically advanced and detail orientated market segment.
3. Wanting to be the first, our company is driven to serve customers in a responsible and shared value-creating approach. We believe that climate change may have long-term direct and indirect implications for our business and supply chain. Thus, we aim to keep the impact of the raw materials we use to a minimum.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!