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Rocket PCB advanced technology quick turn pcb cable for wholesale

Rocket PCB advanced technology quick turn pcb cable for wholesale

Name:
Embedded PCB
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Embedded thin film resistor, embedded capacitor
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB advanced technology quick turn pcb cable for wholesale
Company Advantages
1. Rocket PCB creates a unique feeling on a scientific and reasonable basis. The product is widely applied in consumer electronics
2. Comprehensive sales network helps Rocket PCB win more customers. Its signal paths are well organized and exposed quite well
3. Its fabrics are soft, skin-friendly and breathable. And it allows a pleasant exchange of heat and a good moisture balance. It is specifically designed to lessen the chances of shorts and wiring issues
4. The material of this kind of product with high-quality has high transparency and a certain of fine flexibility with various sizes. Its parts are spaced evenly and traces are symmetric and uniform
5. The product has the advantage of a robust machine structure. Constructed with a rugged metal frame, it is highly resistant to impacts and vibrations. It is properly laid out, giving less electronics noise

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Passive and active chips can be embedded in PCB using two basic processes: face-down and face-down. The two variants differ in the way components are connected to the outside world and use different materials and processes. Figure 1 outlines these two approaches.

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In the front process, the component is placed on the carrier material, and the contact pad of the component can be seen after assembly. This method provides some very good thermal performance and is very suitable for power module embedding. Processing constraints are encountered when trying to embed components with variable thickness. After embedding, the dielectric thickness between the component surface and the external copper surface remains unchanged, which poses a challenge to the subsequent micro-laser drilling and copper plating technology, especially in the case of via filling.

In the face-down process, the component and the component image are assembled together into the carrier material. Normally, screen-printed non-conductive adhesives are used as carriers for fixing components. This method has several advantages: good thickness control of dielectric materials between components and carriers, and good registration accuracy in assembly process. The reason for the improvement of alignment capability comes from the fact that the camera of the assembly machine can see the image of the component, so it can be aligned before the assembly is completed.

In frontal technology, the camera is aligned to the contour of the component.

Using face-down technology, several components of different thickness can be embedded into the FR-4 core. The prepreg used for embedding is removed to form a cavity around the assembly. Prepregs with openings are stacked to the height of the assembly and are provided with non-openings at the top. By opening the dielectrics to various heights of the components, usually ranging from 100 to 350 um, it is easy to achieve different thickness embedding. Then, the embedded kernel can be used as the standard inner core and included in the PCB multi-layer structure. External SMD components can then be assembled on both sides of an embedded PCB to form very high-density modules/components (see Figure 2).

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Embedded capacitors have many advantages, such as saving surface space, improving the product rate of device assembly, reducing power supply noise, reducing electromagnetic interference, simplifying circuit board design, and also raising higher challenges to equipment processing technology.

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Product FEATURES


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  ◪   Reduce surface mounting area by embedding chip components (resistors/capacitors)

  ◪   Improve electrical performance by shortening the wiring distance between surface-mounted ICS and embedded components

  ◪   Shorten the space between components and better heat resistance can be achieved by using a connection between the laser through holes and the copper-plated component terminals



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Known as a leading supplier and manufacturer of quick turn pcb , Rocket PCB Solution Ltd. is competitive in this field. Rocket PCB has been always paying attention to the technological innovation.
2. Paying attention to the high technology will bring more benefits to the development of pcb production .
3. As a core value of Rocket PCB, the position of prototype pcb manufacture technology has been highly valued. Our company is striving for green manufacturing. We choose materials carefully to ensure minimum indoor air emissions and maximize customers' ability to return materials to the resource stream once they have served their intended purpose.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!