High-speed PCB design basics Q&A

HTCC, DBC, Thick Film Ceramic PCB Manufacturing, LTCC, Thin Film Ceramic PCB Manufacturing, DPC, AMB, etc. are all manufacturing processes for ceramic substrates. Among them, DPC process and DBC process are two commonly used ceramic substrate manufacturing processes. Although they are both methods for making ceramic substrates, there are some important differences between them. Please continue reading and let us introduce them to you in detail.

High thermal conductivity ceramic substrate, essential for improving performance

IPC Level 2 represents a standard for reliable electronic products suitable for general use, like communications and industrial equipment. IPC Level 3 is a stricter standard for mission-critical applications, ensuring no failures in harsh environments, such as military and medical equipment. Level 2 is "normal" quality, while Level 3 is for high-performance, long-life products.

Ceramic substrates, such as alumina (Al2O3) and aluminum nitride (AlN), offer superior thermal conductivity (30-180 W/mK) and insulation properties compared to metal-based substrates (under 5 W). Al2O3 is cost-effective but has lower thermal conductivity, while AlN performs better thermally. Ceramic substrates enable direct component mounting, offering better heat dissipation and potential for multi-layer designs.

Ceramic packaging, using materials like Al2O3, AIN, BeO, and mullite, offers advantages such as excellent moisture resistance, high mechanical strength, low thermal expansion, and high thermal conductivity. It’s used in high-density, hermetic packaging for power devices, improving heat dissipation. Ceramic PCB packaging is increasingly popular due to its ability to withstand high temperatures and enhance device performance

Major aluminum nitride substrate manufacturers in China

Aluminum nitride substrate is an electronic ceramic material with excellent performance. With the development of microelectronic devices, its market demand is growing rapidly. It is predicted that the global aluminum nitride substrate market will grow from US$61 million in 2020 to US$107.3 million in 2026. At present, Japan, Europe and the United States dominate the market, but Chinese companies have achieved mass production and have great development potential.

High-Density Interconnect (HDI) PCBs are compact boards with higher wiring density than traditional PCBs, using blind, buried, and microvias to fit more components in smaller spaces. For HDI assembly, solder paste quality is crucial, as its properties—such as viscosity, fluidity, and metal content—directly impact component welding quality.

Semiconductor power devices increasingly require efficient heat dissipation due to higher integration and power density. High thermal conductivity ceramic substrates like Al₂O₃, BeO, SiC, AlN, and Si₃N₄ are essential for managing heat in harsh environments such as high temperatures, pressures, and electric fields, ensuring reliability, energy efficiency, and intelligent integration in electronic systems.

Ceramic PCB is a printed circuit board with a ceramic substrate, which is a highly thermally conductive material such as aluminum oxide, aluminum nitride, and beryllium oxide, which can quickly transfer heat from hot spots and dissipate it across the entire surface. In addition, ceramic PCBs are manufactured using LAM technology, which is a laser rapid activated metallization technology. Therefore, ceramic PCBs are widely used and can replace the entire traditional printed circuit board with a simpler structure and better performance.