Radio frequency (RF) devices are one of the most exciting applications in electronic design right now. Any emerging technology for smartphones, sensors, robotics, and security will require these complex, high-frequency circuit boards. But as we all know, RF PCB design is a complex process that involves many considerations and design ground rules to ensure signal integrity, reduce interference, and maintain efficiency.

High-speed PCB design basics Q&A

HTCC, DBC, Thick Film Ceramic PCB Manufacturing, LTCC, Thin Film Ceramic PCB Manufacturing, DPC, AMB, etc. are all manufacturing processes for ceramic substrates. Among them, DPC process and DBC process are two commonly used ceramic substrate manufacturing processes. Although they are both methods for making ceramic substrates, there are some important differences between them. Please continue reading and let us introduce them to you in detail.

High thermal conductivity ceramic substrate, essential for improving performance

IPC Level 2 represents a standard for reliable electronic products suitable for general use, like communications and industrial equipment. IPC Level 3 is a stricter standard for mission-critical applications, ensuring no failures in harsh environments, such as military and medical equipment. Level 2 is "normal" quality, while Level 3 is for high-performance, long-life products.

Ceramic substrates, such as alumina (Al2O3) and aluminum nitride (AlN), offer superior thermal conductivity (30-180 W/mK) and insulation properties compared to metal-based substrates (under 5 W). Al2O3 is cost-effective but has lower thermal conductivity, while AlN performs better thermally. Ceramic substrates enable direct component mounting, offering better heat dissipation and potential for multi-layer designs.

Ceramic packaging, using materials like Al2O3, AIN, BeO, and mullite, offers advantages such as excellent moisture resistance, high mechanical strength, low thermal expansion, and high thermal conductivity. It’s used in high-density, hermetic packaging for power devices, improving heat dissipation. Ceramic PCB packaging is increasingly popular due to its ability to withstand high temperatures and enhance device performance

Major aluminum nitride substrate manufacturers in China

Aluminum nitride substrate is an electronic ceramic material with excellent performance. With the development of microelectronic devices, its market demand is growing rapidly. It is predicted that the global aluminum nitride substrate market will grow from US$61 million in 2020 to US$107.3 million in 2026. At present, Japan, Europe and the United States dominate the market, but Chinese companies have achieved mass production and have great development potential.