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IC Substrate PCB IC PCB integrated circuit packaging PCB

IC Substrate PCB IC PCB integrated circuit packaging PCB

Name:
IC substrates
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
E-mail:
Product Information of IC Substrate PCB IC PCB integrated circuit packaging PCB
Company Advantages
1. Rocket PCB pwb board is expertly manufactured according to the guidance of lean production method.
2. The product meets customers' needs at market leading prices. It is specifically designed to lessen the chances of shorts and wiring issues
3. Since any defects are completely eliminated during the inspection, the product is always in the best quality state. Its parts are spaced evenly and traces are symmetric and uniform
4. As a result of the implementation of a strict quality management system, product quality has been improved. It offers a simple platform to arrange the electronic components in a compressed way
5. This product has stable performance and long service life. It reduces the need for interconnecting wiring
About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

IC Substrate PCB IC PCB integrated circuit packaging PCB-1

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

  ◪   CSP (Chip Scale Packages)

  ◪   FC-CSP (Flip Chip) CSP

  ◪   COB (Chip on Board)

  ◪   PoP (Package on Package)

  ◪   COB (Chip on Board)

  ◪   PiP (Package in Package)

  ◪   SiP (System in Package)

  ◪   RF Module

  ◪   LED Package



Product application


IC Substrate PCB IC PCB integrated circuit packaging PCB-2                
Consumer electronics
IC Substrate PCB IC PCB integrated circuit packaging PCB-3                
Automotive electronics
IC Substrate PCB IC PCB integrated circuit packaging PCB-4                
Communications
IC Substrate PCB IC PCB integrated circuit packaging PCB-5                
Energy
IC Substrate PCB IC PCB integrated circuit packaging PCB-6                
Industrial & Instrumentation
IC Substrate PCB IC PCB integrated circuit packaging PCB-7                
IOT/Smart Home
IC Substrate PCB IC PCB integrated circuit packaging PCB-8                
Medical electronics
IC Substrate PCB IC PCB integrated circuit packaging PCB-9                
Security Industry

Company Features
1. At present, our pwb board range mainly covers pcb products.
2. Rocket PCB Solution Ltd. commits itself to the promotion of independent R&D ability in many years.
3. There are a big sample display room in Rocket PCB Solution Ltd.. Welcome to visit our factory!
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!