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ceramic ceramic pcb pcb base for electronics

Ceramic ceramic pcb pcb base for electronics

Name:
Ceramic Substrate
Material:
Ceramic
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of ceramic ceramic pcb pcb base for electronics


Rocket PCB is good at aluminium oxide ceramic-based CCL PCB, alumina ceramic PCB, LED ceramic PCB, Al2O3 ceramic PCB, high thermal conduction ceramic PCB, ceramic-based PCB fabrication.

The ceramic PCB relies on ceramics as a matrix material and fabricates electronic parts of metal circuits thereon. It's an indispensable basic material for power module packaging in the electronic field. Ceramic substrates refer to the special method of copper foil bonding on to the surface of alumina (AL2Q3) or Al nitride (AlN) ceramic substrates (single or double sides) at high temperature. The ultra-thin composite substrate has wonderful electrical insulation, high thermal conductivity, wonderful solderability and high adhesion strength. It will etch numerous patterns like PCB board and has nice current carrying capability. Therefore, the ceramic substrate has become the fundamental material of high-powered electronic circuit structure technology and is that the most suitable option for high-powered LED, power devices, microwave devices, automotive electronics, high-frequency devices, solar cell modules and alternative applications.


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Product FEATURES


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Ceramics are superior to other printed circuit boards

  ◪   Higher operating temperatures up to 350℃

  ◪   Low expansion coefficient

  ◪   Good thermal performance

  ◪   Superior high-frequency performance

  ◪   Reduce costs for testing, insertion and assembly

  ◪   Smaller package size

  ◪   Sealed packaging with a water absorption rate of 0%



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

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