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The particularly challenging year of 2024 is about to pass. In our PCB industry, 2024 may be a special year for most companies. After the epidemic, the economic situation did not improve, but turned to conservative development. And due to rising production costs, changes in market demand, global supply chain problems, and industry competition, many factories closed down before 2025.  Some factories closed down in various regions：In Europe, PCB manufacturer Würth Elektronik Circuit Board Technology said it will close the company's PCB production site in Schopfheim, Germany.The company said the main reason for the closure of the plant is the current severe crisis in the European PCB industry, with a sharp drop in orders. The company's decision to close the plant affects more than 300 employees in Schopfheim. After the plant is closed, future orders will be handled by other Würth Elektronik plants in Germany. On the other side of the Baltic Sea, in the Estonian city of Paide, Brandner PCB has been producing PCBs for the electronics industry since 1997, but 2024 will be the company's last year.In an update on its website, Brandner PCB Oü appears to be shutting down its operations at the end of November due to "unfavorable business conditions in the industry."According to the latest news, the plant will be closed for the last time on November 29, and orders will be produced until November 22.Aular Soon, a member of the company's management team, told Estonia's Radio 3 that the deterioration of the business environment made it impossible for the company to continue profitable production, so the decision to close was made.Faraday Printed Circuits Ltd. ("Faraday"), a printed circuit board manufacturer located in Washington, Tyne and Wear, northeast England, has declared bankruptcy due to challenges in the business environment and a decline in orders. The company laid off 39 employees and is preparing to sell assets. Faraday was founded in 1987 (when the plant area was only 4,000 square feet), and its products include: multi-layer boards, double-sided boards, rigid-flex boards, etc. Now, Faraday's production plant in Washington has an area of more than 22,300 square feet, and has established strategic partnerships with many printed circuit board manufacturers in Asia.In North America, on February 8, TTM Technologies, a global PCB leader, issued a press release that it plans to close three manufacturing plants, PCB manufacturing operations in Anaheim, California, Santa Clara and Hong Kong, China, and integrate the affected operations at these locations into TTM's remaining facilities. It is expected that about 750 employees will be laid off, accounting for about 5% of the total number of employees worldwide.There are about 20 large PCB factories that have closed down in China. Among them are well-known companies such as Sichuan Shenbei Circuit Technology Co., Ltd., Shanghai Xinfeng Electronics Co., Ltd., and Yingde Qilida Electronics Co., Ltd. The bankruptcy of these companies not only exposes the competitive pressure within the industry, but also indicates that the PCB industry is about to usher in a large-scale reshuffle. Some readers have heated discussions on this topic on Quora, and the main points can be summarized as follows: (1) Optimistic attitude: It will take 3-5 years to return to normal levels. As investors turn their attention to the recovery after the economic restart, some economists warn that if everything goes well, it may take up to three years for the global economy to return to the level before the new crown pandemic. (2) More cautious: According to the Kondratiev long wave cycle, 2023 to 2033 is the economic recovery period, and the economy will reach the peak of this cycle in 2033. In other words, the global economy will be on the road to improvement in the next 8-10 years. (3) Pessimistic attitude: It is getting colder and colder, and there is no way out. The world economy is currently suffering from a series of adverse supply shocks, which cannot be alleviated by a certain industry, a certain company or certain individuals. As a business owner, you can only go with the flow of the times. 

LED lighting is widely used not only for indoor and outdoor illumination, mobile phone backlight modules, and automotive turn signals but also for high-power projection lights, streetlights, high-intensity lighting, large-size backlight modules, and automotive headlights. These advancements are attributed to the continuous progress in LED technology in recent years, leading to the development of more efficient LED components. With advantages such as energy efficiency, environmental friendliness, and long lifespan, LED light sources have become a mainstream trend.To achieve higher brightness, LEDs require increased power input. However, the wall-plug efficiency (WPE) of high-power LEDs remains limited, typically ranging from 15% to 25%. This means that only a fraction of the input power is converted into light, while the majority is dissipated as heat. Due to the extremely small size of LED chips (typically 1–2 mm), the heat flux density of high-power LEDs is exceptionally high—often more severe than that of conventional IC components. This significantly raises the junction temperature of the LED chip, leading to overheating issues. Excessive junction temperatures reduce LED brightness, particularly accelerating the degradation of red light. Additionally, they can cause wavelength shifts, affecting color rendering and significantly reducing LED reliability, as illustrated in Figure 1. As a result, thermal management has become a critical bottleneck in LED technology development.Thermal design presents a major challenge and must be carefully considered across multiple levels, including the chip level, package level, PCB level, and system module level, to determine the most effective heat dissipation strategies. For LED lighting products, system-level heat dissipation is often constrained, making effective thermal management at other levels even more crucial.To analyze heat dissipation, a thermal resistance network is constructed from the heat source (chip) to the ambient temperature, as shown in the diagram below. By examining the characteristics and magnitude of each thermal resistance value, the ideal chip temperature can be calculated, and targeted strategies can be implemented to reduce thermal resistance. It is important to note that the diagram consists of a thermal resistance network spanning the chip level, package level, board level (MCPCB), and system level. In practical analysis, a more detailed thermal resistance network can be established based on the system structure, incorporating factors such as the thermal resistance of die-attach solder or the thermal resistance of heat dissipation module structures.  Thermal Management Design: Chip-Level, Package-Level, and Metal Core PCB Since the sapphire substrate of LED chips has poor thermal conductivity, it leads to a high junction-to-substrate thermal resistance (Rjs) in the thermal resistance network shown in the diagram. To address this issue, high-thermal-conductivity materials such as copper can be used to replace sapphire, or a flip-chip design can be adopted to remove the substrate from the heat transfer path, thereby reducing thermal resistance.Currently, some of the most effective thermal management designs at the chip-to-package level include the use of co-fused alloy substrates and flip-chip configurations, which facilitate efficient heat transfer from the chip to the package. Another feasible approach is increasing the chip size to lower heat flux density.At the package level, advanced thermal design techniques involve using high-thermal-conductivity metal heat sinks (such as aluminum and copper), as illustrated in Figure 2, as well as high-thermal-conductivity ceramic substrates (such as AlN and SiC). These solutions allow heat to dissipate rapidly from the chip, effectively reducing the package-level thermal resistance (Rsc).At the PCB level, the main difference from traditional PCB designs lies in the significantly higher heat flux density of LEDs. Conventional FR4 + copper foil structures have limited heat dissipation capabilities, making them inadequate for high-power LEDs. To address this, a thicker metal layer is used to reduce spreading resistance, a structure known as Metal Core PCB (MCPCB).    The basic structure of the MCPCB (Metal Core PCB) is shown in Figure 3, which includes a thick metal layer, a dielectric layer, and a copper foil layer. It further spreads the heat from the package and rapidly transfers it to the heat dissipation components of the system module, thereby reducing the thermal resistance value (Rcb)Figure 3   MCPCB structure diagramTo reduce component thermal resistance, some current designs adopt a Chip-on-Board (COB) approach, where LED chips are mounted directly onto the Metal Core PCB (MCPCB). This eliminates the thermal resistance of packaging materials and solder interface layers, thereby improving heat dissipation. Many companies (e.g., Lamina Inc., Citizen Inc., OSRAM Inc., Avago Technologies) have adopted this design in their products. However, this approach introduces challenges in optical design and raises reliability concerns in manufacturing, making the overall design more complex.  Thermal Design of LED Heat Dissipation ModulesThe thermal design of LED heat dissipation modules is critical to ensuring the efficiency and stability of LED lighting systems, as approximately 70-80% of the electrical energy input into an LED is converted into heat. Poor heat dissipation can lead to an increase in LED chip junction temperature, resulting in luminous decay, color shift, reduced lifespan, or even failure. The key aspects of LED heat dissipation module design are as follows: Heat Transfer Pathway: Heat travels from the LED chip → substrate (metal-core PCB) → heat sink → ambient air. It is essential to ensure high thermal conductivity at each stage. Low Thermal Resistance Design: To enhance heat dissipation, the thermal pathway should be minimized, and high thermal conductivity materials (such as copper, aluminum, and graphene) should be used. Additionally, thermal interface resistance should be reduced by filling gaps with thermal grease or thermal pads. Unlike general electronic devices, which typically have ventilation openings that allow PCBs to dissipate heat through convection and radiation, many LED lighting products are enclosed, limiting their heat dissipation capacity. Since the ability of the heat dissipation module to remove heat is closely related to its design, key design strategies include increasing the surface area in contact with air, enhancing convection coefficients, and improving radiative heat dissipation. In lighting applications, additional constraints arise due to factors such as mechanical structure compatibility with traditional lamp designs (e.g., MR16), weight limitations, and outdoor protection requirements (such as dustproof and waterproof ratings—IP standards). These constraints further restrict thermal design flexibility, making optimization a crucial aspect of LED heat dissipation design. Common heat dissipation molds on the marketThermal Design of LED Heat Dissipation ModulesThe thermal design of LED heat dissipation modules is critical to ensuring the efficiency and stability of LED lighting systems, as approximately 70-80% of the electrical energy input into an LED is converted into heat. Poor heat dissipation can lead to an increase in LED chip junction temperature, resulting in luminous decay, color shift, reduced lifespan, or even failure. The key aspects of LED heat dissipation module design are as follows: Heat Transfer Pathway: Heat travels from the LED chip → substrate (metal-core PCB) → heat sink → ambient air. It is essential to ensure high thermal conductivity at each stage. Low Thermal Resistance Design: To enhance heat dissipation, the thermal pathway should be minimized, and high thermal conductivity materials (such as copper, aluminum, and graphene) should be used. Additionally, thermal interface resistance should be reduced by filling gaps with thermal grease or thermal pads. Unlike general electronic devices, which typically have ventilation openings that allow PCBs to dissipate heat through convection and radiation, many LED lighting products are enclosed, limiting their heat dissipation capacity. Since the ability of the heat dissipation module to remove heat is closely related to its design, key design strategies include increasing the surface area in contact with air, enhancing convection coefficients, and improving radiative heat dissipation. In lighting applications, additional constraints arise due to factors such as mechanical structure compatibility with traditional lamp designs (e.g., MR16), weight limitations, and outdoor protection requirements (such as dustproof and waterproof ratings—IP standards). These constraints further restrict thermal design flexibility, making optimization a crucial aspect of LED heat dissipation design. Challenges and Breakthroughs in LED LightingWith the advancement of multi-spectral LED lighting, there is growing emphasis on energy-efficient lighting, health-conscious lighting, and ecological lighting. The ideal solution is to mimic natural sunlight, a goal that can be achieved using LED technology, albeit with several technical challenges. Future innovations may integrate AI-driven algorithms to dynamically adjust thermal management strategies, such as modulating fan speed or controlling thermoelectric module power. Additionally, new designs may integrate heat dissipation structures with LED packaging (e.g.,COB-integrated thermoelectric cooling), leading to more compact and efficient lighting solutions. The development potential of LED lighting technology remains vast. Continued efforts must focus on enhancing energy efficiency and power output. On the application side, lamp design innovation should be actively pursued while expanding into new fields such as smart lighting, non-visual lighting, and high-definition displays. The ultimate technological goal is to achieve natural light illumination, providing people with an energy-efficient, healthy, and comfortable lighting environment.   

What are AI Glasses?AI glasses are a new type of wearable device that have gained significant popularity following the surge in AI models in 2024. In terms of functionality, AI glasses are primarily used for voice interaction and photography. Compared to previous mainstream eyewear products like VR, the biggest improvement in AI glasses is the resolution of user comfort issues. Taking the highly anticipated Meta Ray-Ban second-generation product as an example, it weighs only 49g, less than one-tenth the weight of Meta's VR products. This breakthrough allows AI glasses to be used in a wide range of indoor and outdoor daily scenarios, breaking the previous limitation of VR being mainly used indoors.AI glasses have garnered widespread attention, largely due to Meta and Ray-Ban launching their second-generation product, Meta Ray-Ban, in 2023. In April 2024, they rolled out AI features on a large scale, leading to a significant increase in monthly active users. As of July, the latest activation numbers showed a month-on-month growth of 25.2%. Industry insiders predict that the annual shipment volume could exceed 1.5 million units, with the product remaining in a state of continuous shortage.Hardware Composition of AI GlassesThe core hardware of AI glasses includes the SOC chip, storage chip, camera, acoustics, battery, PCB, and assembly. Among these, the PCB, as the most critical substrate for carrying electronic components, is arguably the most important component. Most AI glasses use Flex PCB as the mainboard because it is the thinnest PCB, which is key to the lightweight design of AI glasses.From an overall perspective, AI glasses are quite similar to ordinary black-frame glasses. Therefore, the design of components and electrical connections within the narrow and twisted space requires considerable ingenuity.Thus, the placement and connection of these components must consider how to achieve the smallest and lightest design. The use of Flex PCB is also because it is not only the thinnest but also lighter, enhancing the user's wearing experience.Functionality of AI GlassesGenerally, AI glasses are a multimodal artificial intelligence device. Users can activate the AI through voice commands. In addition to querying basic daily information such as weather, time, sports scores, and news programs, users can also use voice commands to activate the camera for more visual operations. For example, users can point the glasses' camera at a refrigerator and ask the AI what dishes can be made with the ingredients inside, how to match clothes, identify buildings in front of them, or inquire about the watering needs of a specific plant in the garden.Additionally, AI glasses generally support translation functions, covering languages such as English, Spanish, Italian, French, German, and Chinese. Since the AI capabilities of the glasses rely on cloud computing, a certain response time needs to be accounted for.Some AI glasses also support photography, music, and communication functions. They use open-ear headphone speakers, allowing users to interact via voice commands to specify artists, songs, or music genres. For specific features, please refer to the official website of the respective product.  

On March 24, 2025, the International Electronic Circuit Exhibition (CPCA SHOW 2025) grandly opened at the Shanghai National Exhibition and Convention Center, running for three days. As one of Asia's largest and most influential industry events, this exhibition once again brought together global leading enterprises to explore PCB manufacturing technology innovation and industrial upgrading. Grand Opening CeremonyIn the morning, the CPCA SHOW 2025 Opening Ceremony was held with great fanfare. After CPCA Chairman Lei announced the exhibition open, distinguished guests took the stage together to officially launch CPCA SHOW 2025.  Opening Ceremony Activation  Following the ceremony, key leaders and guests toured the exhibition halls, engaging with cutting-edge industry innovations. Exhibition HighlightsUnder the theme "Innovation-Driven, Intelligent Manufacturing Unlimited", this year’s exhibition focused on promoting industry innovation and technological advancement, showcasing core technologies in electronics manufacturing. The event featured six key exhibition zones, covering: Printed Circuit Boards (PCBs) Electronic Assembly Smart Manufacturing Environmental Protection & Water Treatment Cleanroom Technologies Upstream & Downstream Supply Chains This provided an efficient industry exchange and procurement platform, helping attendees seize new opportunities in the AI era! Star-Studded Exhibitor LineupThe exhibition gathered top-tier PCB manufacturers and suppliers, including: PCB Manufacturers: Shennan Circuits, Etron Tech, BenQ Materials Equipment Suppliers: Xinji Microelectronics, Zhuhai Zhendong, Xinpeng Intelligence, Liyuan Haina, Jinma, Dongwei Tech, Autima, Daliang Tech, showcasing cutting-edge PCB manufacturing technologies. Materials & Chemicals: Dingtai Tech, Guanghua Tech, Jiayuan Tech, Yinghua Materials, Chuyuan New Materials, Jiangnan New Materials, Guangxin Materials, Chengan Group, Liuxin, presenting next-gen PCB materials and solutions. Eco-Tech Companies: Zhending Environmental, Shuiqing Environmental, demonstrating sustainable and water treatment innovations. High-Level Forums & Tech ExchangesBeyond the exhibition, CPCA SHOW 2025 hosted: 2025 Spring International PCB Technology/Information Forum "AI-Era PCB & Advanced Packaging Synergy" Conference Discussions on TGV Glass Substrates & Next-Gen Packaging These forums gathered global industry leaders and experts to explore future trends in PCB and semiconductor integration, fostering collaborative innovation across the supply chain. Additionally, new product launches and tech showcases provided exhibitors with a prime platform to debut groundbreaking innovations. CPCA SHOW 2025 – Where Global PCB Innovation Meets Opportunity!