Rocket PCB  > 

AI - Page Sitemap

 > 

Rocket PCB wholesale wire bonding process wire for digital device

Rocket PCB wholesale wire bonding process wire for digital device

Rocket PCB wholesale wire bonding process wire for digital device

Name:
Gold wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Company Advantages
1. Rocket PCB semiconductor wire bonding is carefully developed based on the guideline of hydromechanics and mechanical dynamics by the R&D department. The R&D team tries to create a product with the most efficient sealing performance. It makes the interconnections less bulky
2. This product is very popular in the market and is widely used in the market. It is properly laid out, giving less electronics noise
3. wire bonding process can be used in many occasions with good status. The electronic components and their polarities on it are clearly labeled

methods

Rocket PCB wholesale wire bonding process wire for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB wholesale wire bonding process wire for digital device-2                
Consumer electronics
Rocket PCB wholesale wire bonding process wire for digital device-3                
Automotive electronics
Rocket PCB wholesale wire bonding process wire for digital device-4                
Communications
Rocket PCB wholesale wire bonding process wire for digital device-5                
Energy
Rocket PCB wholesale wire bonding process wire for digital device-6                
Industrial & Instrumentation
Rocket PCB wholesale wire bonding process wire for digital device-7                
IOT/Smart Home
Rocket PCB wholesale wire bonding process wire for digital device-8                
Medical electronics
Rocket PCB wholesale wire bonding process wire for digital device-9                
Security Industry

Company Features
1. Rocket PCB is well recognized in the wire bonding process industry for its outstanding advantages of semiconductor wire bonding . We benefit from a powerful leadership team. With their decades of rich experience in the industry, they act as an important asset in our decision-making and development strategy.
2. The factory has established a total quality control system. We prevent errors or avoid inferior products by early detection and action by strictly complying with this system.
3. Over the years, we have established a wide sales network throughout the world. With a sales network extending to most parts of America, Australia, and Britain, we have also built a strong customer base. Rocket PCB Solution Ltd. is committed to becoming the most reliable wire bonding services supplier. Check it!
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!