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Rocket PCB wholesale aluminum wire bonding process wire for digital device

Rocket PCB wholesale aluminum wire bonding process wire for digital device

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Product Information of Rocket PCB wholesale aluminum wire bonding process wire for digital device
Company Advantages
1. All components of Rocket PCB are CNC machined and finished by hand and all structures produced are fully certified to global structural safety codes. It is the perfect choice for manufacturers of electronic components, instruments, and equipment
2. Avoiding the waste of traditional homebuilding entirely, this product works as the newest and most eco-friendly way of living. The product features low electric currents and radiation emission
3. The product has obtained international quality certificates and meets the quality standard of many countries and regions. The product brings reliability in the performance of the circuit
4. It is extensively acclaimed in the market owing to stylish patterns and designs. It plays an important role in modern electronic equipment
5. The quality of this product is backed by well-established infrastructure. The electronic components and their polarities on it are clearly labeled

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB wholesale aluminum wire bonding process wire for digital device-1


methods


Rocket PCB wholesale aluminum wire bonding process wire for digital device-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Rocket PCB wholesale aluminum wire bonding process wire for digital device-3



Product application


Rocket PCB wholesale aluminum wire bonding process wire for digital device-4                
Consumer electronics
Rocket PCB wholesale aluminum wire bonding process wire for digital device-5                
Automotive electronics
Rocket PCB wholesale aluminum wire bonding process wire for digital device-6                
Communications
Rocket PCB wholesale aluminum wire bonding process wire for digital device-7                
Energy
Rocket PCB wholesale aluminum wire bonding process wire for digital device-8                
Industrial & Instrumentation
Rocket PCB wholesale aluminum wire bonding process wire for digital device-9                
IOT/Smart Home
Rocket PCB wholesale aluminum wire bonding process wire for digital device-10                
Medical electronics
Rocket PCB wholesale aluminum wire bonding process wire for digital device-11                
Security Industry

Company Features
1. Our company is delighted to have won deserved awards in a multitude of different categories. These awards offer recognition amongst our peers in this competitive industry.
2. We strive to improve the supply chain performance of our customers by filling their high demand for quality manufacturing solutions. Contact!
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