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Rocket PCB top brand wire bonding pcb surface finished for digital device

Rocket PCB top brand wire bonding pcb surface finished for digital device

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
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Product Information of Rocket PCB top brand wire bonding pcb surface finished for digital device
Application Scope
Rocket PCB's printed circuit board is widely used in multiple industries and fields.With a focus on customers, Rocket PCB analyzes problems from the perspective of customers and provides comprehensive, professional and excellent solutions.
  • Rocket PCB top brand wire bonding pcb surface finished for digital device-Rocket PCB-img
Enterprise Strength
  • Rocket PCB is committed to providing customers wholeheartedly. We sincerely provide quality products and excellent services.
Company Advantages
1. The manufacturing process for Rocket PCB simple pcb board has time and technology constrains.
2. The product is put into the market after rigorous inspection.
3. The product, with so many good characteristics, can be used in wide applications.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB top brand wire bonding pcb surface finished for digital device-1


methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
Rocket PCB top brand wire bonding pcb surface finished for digital device-5                
Automotive electronics
Rocket PCB top brand wire bonding pcb surface finished for digital device-6                
Communications
Rocket PCB top brand wire bonding pcb surface finished for digital device-7                
Energy
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Industrial & Instrumentation
Rocket PCB top brand wire bonding pcb surface finished for digital device-9                
IOT/Smart Home
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Medical electronics
Rocket PCB top brand wire bonding pcb surface finished for digital device-11                
Security Industry

Company Features
1. Since many years ago, Rocket PCB Solution Ltd. has set up its own factory to manufacturing high quality wire bonding pcb .
2. The strong technical force and scientific management of Rocket PCB Solution Ltd. have continuously refurbished the products and thus won the market.
3. Rocket PCB Solution Ltd. spares no effort to improve the standard of printed circuit board industry with quality support. Check it! Rocket PCB looks forward to working with you by providing our fantastic wire bonding process . Check it! Rocket PCB ​​can give customers more value than other brands. Check it! Rocket PCB Solution Ltd. has been committed to technological innovation and quality improvement for wire bonding technology . Check it!
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