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Rocket PCB top brand wire bonding bulk fabrication for electronics

Rocket PCB top brand wire bonding bulk fabrication for electronics

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB top brand wire bonding bulk fabrication for electronics
Application Scope
HDI PCB can be applied to different industries, fields and scenes.Rocket PCB is dedicated to solving your problems and providing you with one-stop and comprehensive solutions.
Company Advantages
1. Designed with a built-in automatic fan, Rocket PCB semiconductor wire bonding is created with the purpose of circulating the warm wind evenly and thoroughly inside.
2. The product has the advantage of stable mechanical properties. Having been treated under extremely cold temperatures, its mechanical components are tensile enough to withstand extreme industrial conditions.
3. The product can last for a long time. With its full-shield design, it provides a better way to avoid the leakage problem and prevents its components from damage.
4. With this product, a commodity can stand out from the competition. Personalized customization makes it possible to differentiate commodity.
5. This product can avoid the uncomfortable feeling of sweating when waking up in the middle of the night.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB top brand wire bonding bulk fabrication for electronics-1


methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
Rocket PCB top brand wire bonding bulk fabrication for electronics-11                
Security Industry

Company Features
1. Engaged in wire bonding production for many years, Rocket PCB Solution Ltd. has become a leading company.
2. Rocket PCB Solution Ltd. adopts the internationally advanced quality management system.
3. Rocket PCB Solution Ltd. has been leading the marketplace with wire bonding pcb to supply our clients with a competitive edge. Inquire! Continuous improvement of service quality has always been the main focus of Rocket PCB. Inquire! Rocket PCB Solution Ltd. provides high quality wire bonding process for a number of world famous brands. Inquire!
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!