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Rocket PCB top brand wire bonding bulk fabrication for digital device

Rocket PCB top brand wire bonding bulk fabrication for digital device

Rocket PCB top brand wire bonding bulk fabrication for digital device

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
E-mail:
Company Advantages
1. The manufacturing process of Rocket PCB ic wire bonding meets environmental standards. For examples, the improvements in its design contribute to energy recovery and emission reduction. Thanks to the application of the shielding layer, its signal distortion is reduced
2. This product perfectly caters to the needs of people who want their garments to be durable, to last more than a couple of seasons. Its compact design takes less space in a piece of application equipment
3. The product has renowned excellent seam quality. It has passed the seam strength test in which the product will be stretched with normal force. It makes the interconnections less bulky

methods


Rocket PCB top brand wire bonding bulk fabrication for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB top brand wire bonding bulk fabrication for digital device-2                
Consumer electronics
Rocket PCB top brand wire bonding bulk fabrication for digital device-3                
Automotive electronics
Rocket PCB top brand wire bonding bulk fabrication for digital device-4                
Communications
Rocket PCB top brand wire bonding bulk fabrication for digital device-5                
Energy
Rocket PCB top brand wire bonding bulk fabrication for digital device-6                
Industrial & Instrumentation
Rocket PCB top brand wire bonding bulk fabrication for digital device-7                
IOT/Smart Home
Rocket PCB top brand wire bonding bulk fabrication for digital device-8                
Medical electronics
Rocket PCB top brand wire bonding bulk fabrication for digital device-9                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. is gradually growing into a mature wire bonding manufacturer and supplier.
2. Our wire bonding technology is the excellent offspring of our advanced technology.
3. Through strictly implementing the system of wire bonding pcb , Rocket PCB is able to provide the superior products. Welcome to visit our factory!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!