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2024 Global copper clad laminate market share Copper clad laminate is an important basic material for the electronics industry and one of the PCB board materials. Copper clad laminate and PCB can be used in consumer electronics, automotive electronics, network communications, industrial control and medical, aerospace and other fields. Global copper clad laminate manufacturers share market share (%) Market share three major types of special rigid copper cladlaminate manufacturers (%) From the above chart, it can be seen that Chinese mainland manufacturers lead the global market share in copper-clad laminates (CCL). According to Prismark, the top ten global CCL manufacturers by market share in 2023 were Kingboard (14.6%), Shengyi Technology (14.0%), Taiwan Union Technology Corporation (TUC, 10.3%), Nan Ya Plastics (9.1%), Panasonic (6.7%), ITEQ (6.3%), Taiyo Yuden (4.0%), Doosan Corporation (3.6%), Goldenmax International Group (3.3%), and Nan Ya New Material (3.2%). Among the top ten global manufacturers, Chinese mainland companies—Shengyi Technology, Goldenmax, and Nan Ya New Material—collectively accounted for 20.5% of the global market share. Shengyi Technology, as the world's second-largest CCL manufacturer, holds a leading position in global market share. However, global demand for high-end CCL products remains to be further developed, with Kingboard and Shengyi Technology leading the high-end segment. The three major categories of specialty rigid CCLs include: CCL for IC packaging substrates CCL for RF/microwave circuits CCL for high-speed digital circuits According to Prismark, among the top ten manufacturers in the global specialty rigid CCL market in 2023, Taiwanese companies—TUC, ITEQ, and Taiyo Yuden—collectively held 43.0% of the market share, while Japanese manufacturers—Panasonic, Resonac, Mitsubishi Gas Chemical (MGC), and AGC—held 23.9%, indicating that Taiwanese and Japanese manufacturers dominate the high-end CCL sector.  Main business of the world's top ten copper clad laminate manufacturers No.Company NameMain Business1Kingboard LaminatesCore products include rigid CCL (FR-4, high-Tg, halogen-free), high-frequency/high-speed CCL (for 5G, base stations, servers), and specialty CCL (e.g., high thermal conductivity, metal-based). Holds competitive advantages in consumer electronics and automotive electronics sectors. Subsidiaries (such as Kingboard Chemical and Kingboard Copper Foil) provide full PCB industry chain support, manufacturing and selling multilayer boards, HDI boards, and flexible boards.2Shengyi TechnologyShengyi Technology independently produces CCL, prepregs, insulating laminates, metal-based CCL, resin-coated copper foil, and cover films. These high-end electronic materials are mainly used for manufacturing single/double-sided PCBs and high-layer PCBs, widely applied in high-performance computing, AI servers, 5G antennas, next-generation communication base stations, mainframe computers, high-end servers, aerospace, chip packaging, automotive electronics, smart home, industrial/medical equipment, home appliances, consumer electronics and various mid-to-high-end electronic products.3TUC (Taiwan Union Technology Corporation)TUC is a global leader in high-performance CCL and prepregs, specializing in high-frequency/high-speed, high thermal conductivity, and halogen-free eco-friendly high-end materials.4Nan Ya PlasticsNan Ya Plastics Corporation, a core enterprise under Formosa Plastics Group (FPG), operates in petrochemical raw materials, plastic processing, electronic materials and other fields. It is a global leader in CCL and engineering plastics. Core business includes rigid CCL (FR-4, high-Tg, halogen-free), high-frequency/high-speed CCL (for 5G base stations and servers), high thermal conductivity CCL (for automotive electronics and LED heat dissipation), flexible CCL (FCCL, for flexible circuits), copper clad laminate (CCL), fiberglass cloth (for PCB reinforcement), and epoxy resin (key CCL raw material).5PanasonicPanasonic Corporation is a leading Japanese multinational in consumer electronics, industrial equipment, automotive technology, and energy solutions. In the CCL and electronic materials market, Panasonic is a core supplier of high-end materials. Core business includes CCL and electronic components such as capacitors, resistors and sensors.6ITEQITEQ Corporation is a leading Taiwanese high-performance CCL supplier, specializing in high-speed digital circuit materials, high-frequency materials (millimeter wave applications), high thermal conductivity CCL, halogen-free eco-friendly high-end electronic materials, prepregs and specialty application materials like automotive radar substrates. Products are widely used in 5G communications, AI servers, automotive electronics and other fields.7Taiyo YudenTaiyo Yuden is a leading Japanese electronic components and materials manufacturer. Its main businesses include ceramic capacitors, inductors/filters, high-frequency materials, and energy devices. In the CCL field, Taiyo Yuden mainly supplies high-frequency/high-speed materials, though this accounts for a relatively small portion of total revenue.8DoosanCorporationDoosan Corporation is a large South Korean multinational conglomerate operating in industrial equipment (construction machinery: excavators, loaders - global top 10 construction machinery brand; gas turbines and power generation equipment for power plants and marine power systems; desalination equipment), energy solutions, engineering machinery, electronic materials and other fields. In the CCL and electronic materials market, its subsidiary Doosan Electronics is a core supplier.9Goldenmax International GroupGoldenmax International Group is primarily engaged in R&D, production and sales of CCL, the fundamental material for the electronics industry. Main products include various general-purpose CCL series (FR-5, FR-4, CEM-3), aluminum-based CCL, prepregs, as well as specialty series featuring halogen-free environmental protection, high flame retardancy, CAF resistance, high-Tg, and high CTI. These are widely used in home appliances, computers, lighting, automotive, communications and other industries, demonstrating strong industrial stability.10Nan Ya New MaterialThe company's core business encompasses the design, R&D, production and sales of composite materials and related products, primarily including CCL (Copper Clad Laminate) and prepregs. 

Origin of LED Metal Core PCB DevelopmentThe development process of LED chips, core components of modern lighting, displays and electronic devices is closely related to the progress of science and technology. At present, LED chips have become an indispensable key material in many fields such as lighting, display, backlight and sensor. MCPCB is an indispensable part of LED lighting system. In order to ensure that the technology operates in the best way, it is crucial to thoroughly understand its characteristics. Let's first understand LED Metal Core PCB.-----------------------------------|   Silkscreen Layer       |-----------------------------------|    Solder Mask Layer     | -----------------------------------|    Copper Circuit Layer  |-----------------------------------|    Dielectric Layer          |-----------------------------------|    Metal Substrate       |----------------------------------- |    Protective Coating     | -----------------------------------The above diagram is the structure of LED Metal Core PCB. The core feature of MetalCorePCB is the use of metal materials (usually aluminum or copper) as a substrate to improve thermal conductivity and mechanical strength. The structure of MCPCB mainly includes the following key layers: (1). Metal substrateThe metal substrate is the main component of MCPCB and directly determines the heat dissipation performance and mechanical strength of PCB. Common metal substrate materials include:Aluminum is the most common MCPCB substrate material with good thermal conductivity (about 150-200W/m·K), light weight and low cost, suitable for general LED lighting and power electronics products. Copper has higher thermal conductivity than aluminum (about 380-400W/m·K), but the cost is higher. It is mainly used for high-power LED and high heat dissipation applications such as automotive electronics and communication equipment. Although stainless steel has poorer thermal conductivity than aluminum and copper, it has strong mechanical strength and is suitable for special environment applications with high durability requirements. (2). Dielectric layerThe dielectric layer is a key layer in MCPCB, located between the metal substrate and the circuit layer, and mainly plays the dual role of electrical insulation and thermal conductivity.Mainly use insulating materials with high thermal conductivity (1-5W/m·K), such as epoxy, polyimide (PI), and ceramic-filled polymer. This layer needs to be thick enough (usually 50μm-150μm) to provide reliable electrical insulation, but it should not be too thick to avoid affecting the thermal conductivity. (3). Conductive layer (Copper circuit layer)The conductive layer is the circuit part of the MCPCB, which is made of copper foil, similar to the copper layer of traditional PCB, but generally thicker than the copper layer on the standard FR4PCB to meet the requirements of high current load and low resistance.The thickness of the copper foil is usually between 1oz (35μm) and 6oz (210μm). The appropriate thickness is selected according to the application requirements. The required circuit pattern is formed by etching or laser processing. In some high-power applications, electroplating processes such as tin (Sn), gold (Au) or silver (Ag) can also be used to improve soldering performance and oxidation resistance. (4) Protection layer (Resistance wire mesh)The protection layer includes:The solder mask (about solder mask) is used to protect the copper circuit from short circuit and oxidation, usually in green, white or black ink. The silk screen layer (Printed by screen printing) is used to mark the location of components, company logo, product model and other information. (5). Thermal through hole (Hot channel, suitable for multilayer MCPCB)For multilayer MCPCB or high-power applications, it may increase the thermal through hole (passage of heat) to enhance the heat dissipation effect.These through holes can be filled with thermal paste (Hot paste) or copper pillars (sheet copper) to further reduce thermal resistance and improve the overall heat dissipation performance.   Development History of LED Chips and Metal Core PCBSince the invention of LED technology in the 1960s, the LED industry has undergone a transformative journey from fundamental research to widespread industrial applications. Over decades of development, the global LED market has expanded significantly, with continuous technological breakthroughs and increasingly diverse product applications. 1. Lighting ApplicationsThe luminous efficacy and lifespan of LED chips have now matched or surpassed those of traditional lighting products, giving LED lighting clear advantages in energy efficiency, environmental sustainability, and health benefits. With technological advancements, the luminous efficacy of LED chips has steadily improved, costs have decreased, and market acceptance has grown. LED lighting products have gradually replaced traditional incandescent and fluorescent lamps.2. Display TechnologyThe application of LED chips in displays has evolved from early indicator lights and numeric displays to color screens and LCD TV backlighting, profoundly impacting the display industry. As miniLED and microLED technologies mature, LED chips are enabling ultra-high resolution, ultra-thin, and ultra-bright display applications. These advancements are expected to drive the next generation of display technologies.3. Emerging ApplicationsWith the rise of IoT (Internet of Things), smart homes, and other emerging industries, LED chips are increasingly used in sensor communication and related fields.In smart homes, LED chips enable functions like adjustable lighting and ambient atmosphere creation.In IoT, LED chips serve as low-cost, low-power sensors for environmental monitoring, motion detection, and more.These new applications are creating fresh growth opportunities for the LED chip industry. LED Lighting Trends and Thermal ChallengesThe continuous advancement of Solid-State Lighting (SSL) technology has driven significant improvements in LED luminous efficacy, enabling LEDs to replace traditional light sources. Current LED efficacy now exceeds that of incandescent and halogen lamps and continues to grow (as shown in Figure 1). Some companies have developed LED components with efficacy exceeding 100 lm/W, further broadening LED applications. These include indoor/outdoor lighting, smartphone backlight modules, automotive turn signals, and high-wattage projectors, streetlights, large backlight modules, and automotive headlights. Advantages such as energy savings, environmental friendliness, and long lifespan reinforce the trend toward LED lighting becoming the dominant mainstream technology.   Different applications of LED metal core PCB in consumer electronics1. Consumer electronics industry. Consumer Electronics ApplicationsAdvantagesMobile Phones Reduce heat from high-end processorsTablets Extend battery life and enhance touch screen sensitivityGaming Consoles Maintain effective communication between CPU/GPU and memory componentsTelevisionsEfficient power management for better color accuracy and contrastHome AutomationDimmable lighting fixtures with improved lumen outputAudio PeripheralsLower system noise by blocking EMI/RFI interferenceCCTV CamerasReduce thermal stress on optical/detection sensors; complement night vision technology   2. Medical Industry applications Medical Industry ApplicationsAdvantagesSurgical LightsProvide high-intensity illumination while reducing heat buildup, efficiently dissipating heat to avoid overheating impacts on the surgical environment, ensuring stable operation over extended periods.Scanning Equipment (e.g., MRI, CT)Improve circuit heat dissipation, enhancing device stability and imaging accuracy.Wearable Health DevicesReduce circuit heat generation, improving sensor accuracy and battery life.3. Automotive Industry ApplicationsAutomotive Industry Applications AdvantagesHeadlights and Taillights Improve light efficiency, reduce heat, and extend the lifespan of the lighting fixtures.Electric Vehicle Battery Management Systems (BMS) Optimize heat dissipation, enhance battery charging and discharging efficiency, and improve safety.Central Control Displays and DashboardsLower the temperature of electronic components, extend device lifespan, and improve display stability. 4. Industrial Lighting and Automation Industry ApplicationsIndustrial Lighting and Automation Industry AdvantagesLED Workshop LightingEnhance energy efficiency, reduce maintenance requirements, and extend the lifespan of lighting fixtures.Industrial Robots Optimize heat dissipation for electronic control units, improving operational stability of robots.Smart Control Panels Enhance heat dissipation capabilities for high-power components, ensuring long-term reliability.  5. Aerospace Industry ApplicationsAerospace Industry Applications  AdvantagesAircraft Cockpit DisplaysImprove heat dissipation efficiency of electronic equipment, reduce weight, and enhance energy efficiency.Satellite Communication Systems Increase heat resistance of electronic modules, ensuring long-term stability of aerospace equipment.Navigation and Lighting Systems Improve light efficiency, reduce energy consumption, and adapt to extreme environmental temperatures. 6. Home Appliance Industry ApplicationsHome Appliance Industry Applications AdvantagesRefrigerator DisplaysUsed for backlighting in refrigerator temperature control panels.Efficient heat dissipation ensures clear visibility of the display.Microwave Oven  Increase heat resistance of electronic modules, ensuring Used 7. Public Facilities Applications Public Facilities ApplicationsAdvantagesStreet LightsUsed for high-brightness LED street lights.Efficient heat dissipation, adaptable to outdoor high and low-temperature environments, extending service life.Landscape LightingUsed for decorative LED lighting in parks and buildings.Improved energy efficiency and reduced maintenance costs.     LED Layout and Wiring Technology Analysis PCB design is essential for reliable electronic products. The first step to the success of metal core PCBs is to complete a perfect PCB design. The placement of LED components and the creation of networks are very important for metal core PCBs. The location of LEDs affects the lighting intensity and distribution. Wiring sets the path for data transmission and power supply through wires. A good LED setup ensures that each component is balanced and does not overheat or overload. To design an efficient and effective LED metal core PCB, various factors need to be considered. In order to address the design considerations of LED metal core PCBs, including thermal management, trace width and spacing, node placement, and LED arrangement and direction, we need to clearly understand the importance of each aspect. To ensure good heat dissipation, electrical reliability, and mechanical stability. The following are the main design considerations: 1. Material selectionSubstrate material: Common substrate materials are aluminum-based and copper-based PCBs. Aluminum-based is cost-effective, and copper-based has better thermal conductivity but higher cost.Insulation layer (dielectric layer): Insulation materials with high thermal conductivity, such as ceramic-filled polymers, are selected to improve thermal conduction efficiency.Copper foil thickness: Choose the appropriate thickness according to the current demand, the common range is 1oz (35μm) to 3oz (105μm).2. Circuit designWiring and heat dissipation are the key to LED metal core PCB. The spacing of the wiring will affect the heat dissipation and current carrying capacity, so we must carefully select the trace width and spacing. When selecting the trace width and spacing, please consider the operating temperature, total power consumption, performance level and circuit board environment. Recently, narrow traces and tight spacing have been used in LED strip lighting fixtures. But this can cause excessive heat accumulation, resulting in prototype failure. We must consider the trace width and spacing more seriously to avoid such risks in the future. Indeed, wiring and heat dissipation are core issues in the design of LED metal core PCB (MCPCB), especially the choice of trace width and spacing will directly affect the heat dissipation performance, current carrying capacity and the reliability of the circuit. Here are some key considerations and design recommendations to help avoid heat dissipation issues and prototype failures caused by improper routing: (1). Trace width and current carrying capacityCurrent carrying capacity: Trace width determines the current it can carry. Excessive current will cause the trace to heat up, affecting LED performance and life.Refer to the IPC-2221 standard to calculate the trace width based on the current and allowable temperature rise.For example, with a 1oz copper thickness (35µm), a 1mm wide trace can carry about 1.5A of current (temperature rise of 10°C).Power consumption and temperature rise: LED light strips usually have a large operating current, and the trace width needs to be adjusted based on the total power consumption and heat dissipation capacity to avoid local overheating.(2). Trace spacing and heat dissipationToo small spacing: causes heat concentration and increases local temperature rise. It may cause electrical short circuits or insulation failure.Too large spacing: wastes PCB space and increases costs. It may affect signal integrity (in high-frequency circuits).Recommendation: For LED light strips, the trace spacing should be at least 1.5 times the trace width to ensure heat dissipation and electrical safety. In high-power LED applications, the spacing should be further increased to avoid heat accumulation.(3). Operating temperature and environmentOperating temperature: The operating temperature of the LED directly affects its light efficiency and life. The design of trace width and spacing must ensure that the PCB temperature is within a safe range. Use thermal simulation tools (such as ANSYS, Flotherm) to evaluate the thermal performance of the wiring design.Ambient temperature: If the PCB is used in a high-temperature environment (such as outdoor lighting), the trace width and spacing must be further increased to cope with the additional heat load. (4). Risks of narrow traces and tight spacingHeat accumulation: Narrow traces and tight spacing will result in heat that cannot be effectively dissipated, increasing local temperature rise, which may cause LED failure or PCB delamination.Degradation of electrical performance: High temperature will reduce the performance of the insulation layer and increase the risk of short circuits.Solution: Avoid excessive pursuit of compact design and give priority to heat dissipation and reliability.Add thermal vias or use insulating materials with higher thermal conductivity in high-density wiring areas.(5). Node placement and future expansionNode placement: The location of nodes (such as pads, vias) on the LED metal core PCB will affect wiring and heat dissipation. Nodes should be distributed as evenly as possible to avoid heat concentration. High-power nodes (such as LED driver circuits) should be close to heat dissipation paths (such as metal substrates). Future expansion:Reserve a certain amount of wiring space during design to facilitate future upgrades or modifications. Consider modular design to facilitate replacement or expansion of LED modules.(6). Design verification and testingThermal simulation: Use thermal simulation tools to evaluate the thermal performance of the wiring design during the design phase and optimize the trace width and spacing.Prototype testing:Measure the temperature of key nodes on the PCB to ensure that it is within a safe range.Check for local overheating or electrical failures.(7). Practical design recommendationsTrace width:Low-power LED: 0.2mm - 0.5mm.High-power LED: 1mm - 2mm (adjusted according to current size).Trace spacing:Low-power LED: ≥ 0.2mm.High-power LED: ≥ 0.5mm.Copper thickness:General application: 1oz (35µm).High-power application: 2oz (70µm) or higher. SummaryIn LED metal core PCB design, the selection of trace width and spacing needs to balance electrical performance, heat dissipation and cost. Although narrow traces and close spacing can save space, they may bring heat dissipation problems and reliability risks. Through reasonable design, thermal simulation and prototype testing, these problems can be effectively avoided to ensure the long-term stable operation of the PCB. In the future, with the advancement of LED technology, node placement and wiring design may become more complex, so scalability and flexibility should be fully considered during design.3. Electrical testing.After our LED metal core PCB design is put into production, it must undergo rigorous testing to ensure product safety and optimal performance. Visual InspectionVisual inspection is required to inspect LED metal core PCB. This includes observing the surface and components of the board. It helps to identify any visible defects such as cracks, scratches, soldering or layout issues that may affect performance.Inspectors must evaluate visible attributes and verify whether they meet standards, requirements and specifications. Any deviation may lead to failure. Visual inspection is the simplest and most direct type of inspection. Through this inspection, we can check whether the surface and components are intact.Electrical Testing Testing electrical components in LED metal core PCB is an important part of the manufacturing process. In order to ensure optimal performance and expected life, multiple tests are required. To ensure its performance and reliability. Commonly used tests include continuity test, insulation resistance test, withstand voltage test, functional test, flying probe test, impedance test, thermal fault detection and X-ray detection. According to the specific application scenario and needs, choosing the right combination of test methods can effectively improve product quality and yield.(1). Open and Short Circuit TestPurpose: Detect whether there is a break (open circuit) or short circuit to ensure circuit integrity.Method: Flying Probe Test: Use movable probes to test the conductive paths on the PCB, suitable for small-volume production or prototype verification.Bed of Nails Test: Use a fixed probe grid to test multiple nodes at the same time, suitable for mass production.(2). Insulation Resistance TestPurpose: Ensure the insulation between different circuits to prevent leakage or electrical breakdown.Method: Apply high-voltage direct current (DC 100V ~ 1000V) to measure the insulation resistance between different electrodes, usually requiring more than 100MΩ.(3). Hi-Pot Test, High Voltage TestPurpose: Check the high-voltage resistance of the PCB dielectric layer to ensure that it will not be electrically broken down in a high-voltage environment.Method: Apply a DC or AC voltage several times higher than the working voltage (e.g. 1.5kV) to test whether the PCB insulation layer is broken down or the leakage current exceeds the standard.(4). Contact Resistance TestPurpose: Detect the resistance value of PCB traces to ensure low power consumption and efficient energy transmission.Method:Use the four-wire method (Kelvin Test) to accurately measure small resistance values and avoid test errors.(5). Functional Test (FCT)Purpose: Simulate the actual working state of LED PCB and detect the overall electrical performance.Method:Lighting Test: Power the LED and check whether it emits light normally.Voltage/current test: Ensure that the power of LED and circuit components meets the design requirements.PWM (Pulse Width Modulation) Control Test: Check LED dimming and power management functions.(6). High Temperature Aging Test (Burn-In Test)Purpose: Detect the stability and life of LED PCB under long-term high temperature operation.Method:Operate LED for a long time in a high temperature environment (85℃ ~ 125℃) to observe whether there are any faults, such as light decay, flickering or current abnormality.(7). EMI/EMC test (electromagnetic compatibility test)Purpose: To ensure that the LED PCB does not generate excessive electromagnetic interference (EMI) and is not interfered by the external electromagnetic environment (EMC).Method: Radiated emission test: Measure whether the electromagnetic waves during the operation of the PCB meet industry standards (such as FCC, CE).Conducted interference test: Detect whether the interference of the LED drive circuit to the power line exceeds the standard.   Possible changes in future LED metal core PCB designIntelligent thermal management routing: In the future, intelligent algorithms may be used for PCB routing optimization, combined with thermal simulation tools (such as ANSYS, Altium Designer) to dynamically adjust routing width and layout. Variable thickness copper foil may be integrated to thicken the copper layer in high current areas to improve heat dissipation. New materials: Future MCPCBs may use graphene-enhanced thermal conductive layers or ceramic composite substrates (such as aluminum nitride, beryllium oxide) to improve overall thermal conductivity. It may even introduce flexible metal substrates to provide better thermal management in applications such as LED light strips.Three-dimensional wiring technology: The current PCB design is mainly planar routing, which may develop into three-dimensional wiring in the future, adding three-dimensional thermal conductive paths in multi-layer PCB structures to improve heat dissipation.For example, using embedded thermal channels to conduct heat to the heat sink or housing more efficiently.Active cooling technology In the future, LED PCBs may integrate micro heat pipes or phase change materials (PCM) to manage heat more efficiently in high-power LED designs. It may even be combined with thermoelectric cooling technology (such as Peltier elements) to improve the stability of LEDs in extreme environments. ConclusionThe optimization of wiring width and spacing remains the key to future LED metal core PCB design, but materials, heat dissipation structure and intelligent design will become important factors affecting the future development of LED PCBs. Who knows what the future of node placement of LED PCBs will be like? Perhaps in the future, LED lighting will directly adopt chip-level cooling, and even no longer rely on traditional PCBs, but adopt new integrated packages (such as Chip-on-Board, COB). This may completely change the way LED PCBs are designed.

What are the advantages of Metal Core Printed Circuit Boards? 1. Understand the types of metal bases used in MCPCB Metal core PCB materials are mainly aluminum PCB, copper-based PCB, and iron-based PCB. However, aluminum is the most common one in the market, and it is usually used in the LED industry due to its price advantage.The core (base) material of our common PCB is ordinary FR4/CEM1-3, while the metal core PCB (MCPCB) is a printed circuit board (PCB) with a metal base, which helps to dissipate heat. MCPCB is also called thermal PCB, insulated metal substrate (IMS), thermal cladding PCB. Metal materials are aluminum, copper and steel alloys.  2. Types of Metal Bases Used in MCPCBAluminum CoreAluminum core PCB, also called aluminum PCB, has good heat transfer and heat dissipation capabilities and is relatively cheap; it is the most commonly used type of metal PCB in the LED industry. The characteristics of aluminum substrate MCPCB are divided into 3 parts as follows:Features:llAluminum thickness: 2mm to 8mmllThermal conductivity: 5W/(mK) to 2.0W/(mK) (watts per meter Kelvin)llCoefficient of thermal expansion: 23ppm/°CllThermal conductivity: 80-90mm²/sllBreakdown voltage:>3000VlDielectric loss angle: 0.03Structure:(1) Circuit layer (copper layer)This is the copper foil layer of the printed circuit, from 1.0 ounce to 8 ounces (35um-280um) Min.Trace/space5/5mil (127/127mm)(2) Dielectric layer (insulating barrier)If the raw materials have good prices and delivery time in China for the production of materials, we also have many customers choose BergquistThermal-clad and stretched board materials to strictly meet customer requirements to produce ALPCB. (3) Substrate layer (metal layer) There are 4 types of aluminum, 1001, 3001, 5052, 6063. If there is no such requirement, we use 5052 for high thermal conductivity (2.0 W/mk or higher), AL1001, AL3001 for 1.0 W/mk to 1.5 W/mk. This is a single-layer Aluminum Core substrate structure.Copper core PCBCopper core PCB is a copper circuit layer PCB with a copper substrate insulation layer, also known as copper substrate PCB copper base PCB copper clad PCB. It can also be used in the LED field. Although copper core PCB and aluminum core PCB have similar characteristics and functions, there are still some differences between the two PCBs. For example, the difference in price and thermal conductivity. Copper-based printed circuit boards are one of the most expensive metal substrates, and their thermal conductivity is many times better than that of aluminum and iron substrates. It is suitable for high-frequency circuits, high and low temperature change areas and precision occasions, communication equipment heat dissipation and architectural decoration industries.  Features:Copper thickness: 35μm to 280μmThermal conductivity: The thermal conductivity of ordinary copper core PCB is 1W/mK to 9W/mK, while the thermal conductivity of copper core PCB with thermal isolation is 400W/mK. Thermal expansion coefficient: 17ppm/°C, the thermal expansion coefficient of copper is about 17 ppm/°C, which is close to the thermal expansion coefficient of silicon chip (about 2.6 ppm/°C), reducing the impact of thermal stress on the circuit.Thermal conductivity: 100-120Density (g/cm³): 8.96Structure: Iron-based PCBIron-based printed circuit boards (PCBs), also known as metal core PCBs (MCPCBs), use iron as a substrate material to replace traditional FR4, providing enhanced heat dissipation and mechanical strength, especially in high-power applications. Features：Thermal conductivity: The thermal conductivity of iron-based PCBs is usually between 30-50 W/m·K, and the specific value depends on the composition of the iron-based material (such as pure iron or iron alloy) and the material of the insulating layer. Thermal expansion coefficient: The thermal expansion coefficient of iron-based PCBs is about 11-12 ppm/°C, which is closer to the thermal expansion coefficient of silicon chips (about 2.6 ppm/°C) compared to the thermal expansion coefficient of copper (about 17 ppm/°C) and the thermal expansion coefficient of aluminum (about 23 ppm/°C). This low thermal expansion coefficient gives iron-based PCBs better dimensional stability in high temperature environments and reduces the impact of thermal stress on the circuit.Thermal conductivity：The thermal conductivity of iron-based PCBs is usually between 10-15 mm²/s, and the specific value depends on the thermal conductivity, density and specific heat capacity of the material.Structure: Iron-based PCB consists of three layers: circuit layer (copper foil), insulation layer (such as modified epoxy resin) and metal base layer (iron or iron alloy). This structure makes it perform well in electronic devices with high power and high heat dissipation requirements. The following table compares the parameters of the three metal cores: parameterIron-based PCBAluminum PCBCopper-based PCBThermal conductivity (W/m·K)30-50200400Coefficient of thermal expansion (ppm/°C)11-122317Thermal conductivity (mm²/s)10-1580-90100-120  3. Principle of heat conduction of metal core PCB: Excessive heat accumulation in the circuit board can cause equipment failure. Electronic devices that generate a lot of heat cannot always be transferred from a hot component to a cooler component through direct contact. This method works well because heat always tries to transfer to any cooler object or medium.  4. Advantages of Metal Core PCBMetal core PCB uses metal material as its base, which is used for the heat sink part of the circuit board. During the operation of the circuit board, heat is generated due to certain electronic components. The role of gold is to transfer heat from key circuit board components to less important areas, such as metal heat sink backplane or metal core. Therefore, different metal cores have different advantages, but these PCBs are suitable for thermal management. Whether it is iron-based PCB, aluminum-based PCB, or copper-based PCB, they all have excellent heat dissipation performance, can effectively conduct and dissipate heat, and are suitable for high-power devices such as LED lighting, automotive electronics, and industrial control equipment. Iron-based PCB has high rigidity, can withstand external shock and vibration, has high mechanical strength, and can effectively shield external electromagnetic interference, improving the stability and reliability of the circuit. The dimensional change in high temperature environment is small, which is suitable for applications with high precision requirements. Although the thermal conductivity is lower than that of copper-based PCB and aluminum-based PCB, compared with aluminum-based and copper-based PCB, iron-based PCB has higher mechanical strength and magnetic conductivity. Iron still has advantages in specific application scenarios (such as occasions where magnetic conductivity or high mechanical strength is required).The density of aluminum in aluminum-based PCb is low (about 2.7 g/cm³), which is suitable for weight-sensitive applications. Compared with copper-core PCB, aluminum-based PCB has lower manufacturing cost, mature manufacturing process, high reliability, and can be mass-produced. Aluminum-based PCB has certain rigidity and impact resistance, suitable for general industrial applications.The thermal conductivity of copper-core PCB is better than that of aluminum and iron, up to 400 W/m·K, which is several times that of the former two. It can quickly conduct and dissipate heat and is suitable for high-power devices. Copper has excellent electrical conductivity and is suitable for high-frequency circuits and signal transmission. And like iron-based PCB, it has high rigidity and impact resistance, and can be used in harsh environments. The thermal expansion coefficient of copper is about 17 ppm/°C, which is close to the thermal expansion coefficient of silicon chips (about 2.6 ppm/°C), reducing the impact of thermal stress on the circuit. It has good electromagnetic shielding performance and can effectively reduce electromagnetic interference (EMI).5. Disadvantages of metal core printed circuit boards. Iron-based PCBs are difficult to manufacture and costly, and have relatively few market applications, mainly in high-end fields. They are heavy and have limited supply of large sizes. Copper-core PCBs are expensive and have complex manufacturing processes. They are heavy and not suitable for weight-sensitive applications. Aluminum-based PCBs have a high coefficient of thermal expansion and may produce thermal stress in high-precision applications. Their mechanical strength is not as good as copper-core PCBs and iron-based PCBs. 6. Production ProcessIron-based PCB:Grinding:Surface treatment using 500# brushes.Washing and Passivation: Cleaning the surface and performing passivation treatment to prevent oxidation.Drying: Ensuring the substrate is dry to avoid issues in subsequent processes. Copper-core PCB:The manufacturing process of copper-core PCB is more complex and mainly includes the following steps:Substrate Preparation: Selecting high-purity copper or copper alloy as the base material.Insulation Layer Coating: Applying high thermal conductivity insulating material on the copper substrate.Circuit Layer Fabrication: Forming circuit patterns on the copper foil through etching process.Drilling and Surface Treatment: Drilling and completing surface treatments (such as gold plating, silver plating, etc.).Testing and Inspection: Conducting electrical and thermal performance tests. Aluminum-based PCB:The manufacturing process of aluminum-based PCB is relatively mature and mainly includes the following steps:Substrate Preparation: Selecting high-purity aluminum or aluminum alloy as the base material.Insulation Layer Coating: Applying high thermal conductivity insulating material on the aluminum substrate.Circuit Layer Fabrication: Forming circuit patterns on the copper foil through etching process.Drilling and Surface Treatment: Drilling and completing surface treatments (such as gold plating, silver plating, etc.).Testing and Inspection:Conducting electrical and thermal performance tests. 7. Applications of Metal-core PCB Iron-based PCBs can be used in some high-performance floppy disk drives, brushless DC motors for computers, motors for fully automatic cameras, high-end motors and motor metal heat dissipation substrates, as well as some military cutting-edge technology products. Both copper-core PCBs and aluminum-based PCBs can be used in high-power LED lamps, providing efficient heat dissipation performance. In automotive electronics, they are used in engine control modules, vehicle power supplies, and other electronic equipment in high-temperature environments. In industrial control, they can be used in PLCs, frequency converters, and other equipment, providing stable heat dissipation and mechanical support. Aluminum-based PCBs are commonly used in everyday consumer electronics due to their lower cost, while copper-core PCBs are used in electronic equipment with high reliability and performance requirements, such as aerospace equipment and communication equipment for high-frequency circuits and RF modules, reducing signal loss. Application Comparison:ApplicationAluminum-based PCBCopper-based PCBIron-based PCBLED Lighting✓––Automotive Industry✓✓–Power Electronics✓✓–High-Power Electronic Devices–✓–Aerospace Industry–✓–Low-Power Electronic Products––✓Magnetic Applications––✓ The table above compares the applications of aluminum-based, copper-based, and iron-based PCBs.8. Metal Core PCBs vs. FR4 PCBsMetal core boards transfer heat 8 to 9 times faster than FR4 PCBs. These metal laminates keep the temperature of heat-generating components at bay by dissipating heat at a faster rate, and the dielectric material is as smooth as possible to form an easy, short path from the heat source to the metal backplane. This helps dissipate heat faster. The thickness of the dielectric material is typically 0.003 inches to 0.006 inches.Compared to standard FR4 boards, metal core PCBs offer superior heat dissipation, electrical performance, and structural stability, which are key factors in electronics working in harsh conditions. The high thermal conductivity of metals such as aluminum and copper enables metal core PCBs to conduct heat away from sensitive components more effectively than FR4 boards. Even when high-power circuits and processors are closely arranged on the PCB, temperatures can be better controlled to prevent hot spots. By addressing thermal management issues, metal core PCBs can withstand greater power densities without overheating.Additionally, the electrical properties of metal substrates can reduce signal loss, noise, and interference at high frequencies and high speeds compared to standard PCB dielectrics. This makes metal core PCBs ideal for RF, microwave, and other high-frequency applications up to gigahertz. The dimensional stability of metals can also resist mechanical warping over a wide thermal range, helping to prevent structural failures caused by temperature changes and gradients. For advanced circuits where reliability and precision are critical, metal core PCBs can significantly improve heat dissipation, electrical efficiency, and structural stability under severe operating conditions.ParametersMetal Core PCBStandard FR4 PCBThermal ConductivityHigher thermal conductivity, typical value: 1 W/mK to 7 W/mKLower thermal conductivity, typical value: 0.3 W/mK to 0.4 W/mKThicknessLimited thickness variation, depending on the available backplane thickness and dielectric layer thickness.Multiple thickness options are available.Heat DissipationMetal core dissipates heat quickly, eliminating the need for thermal vias. Lower heat transfer rate. Requires vias for heat transfer.Plated Through-Hole (PTH)PTH is not available in 1-layer PCBs; components are surface-mounted.PTH is implemented.  Processing ProcedureInvolves the same standard processes, except that the V-scoring process uses diamond-coated saw blades to cut the metal.Standard processing techniques include drilling, routing, V-scoring, countersinking, and counterboring.Solder MaskFor LED boards, the solder mask is white and applied only to the top layer.Includes darker colors such as green, red, blue, and black.RigidityCapable of withstanding impact and vibration, with stiffness 2 to 4 times higher than FR4 or polyimide designs.Lower rigidity compared to metal-core designs.CostRelatively more expensive than FR4 boardsMore cost-effectiveThe above table lists the different characteristics of metal core PCBs and FR4 PCBs. 9. Future Development TrendsAs electronic devices continue to increase their requirements for heat dissipation and performance, the application of copper core PCBs in high power, high frequency transmission and complex environments will further expand. In the future, metal PCB may find more applications in high density interconnect technology (HDI) and flexible electronic devices. FAQ:1. How to Choose Metal Core PCBsWhen choosing a metal core PCB, you must consider the following factors:Thermal conductivity: If you are dealing with high power applications, choose a metal core PCB with high thermal conductivity. Electrical conductivity: Choose a metal core PCB with good electrical conductivity to ensure good signal transmission. Strength: If the application requires it, choose a metal core PCB with high strength. Compatibility with soldering process: Choose a metal core PCB that is compatible with the soldering process used in the manufacturing process. Cost: Choose a metal core PCB that fits your budget. Available in large sizes: Choose a metal core PCB that fits your application.2. Where to Buy Metal Core PCBsMetal core PCBs can be purchased from a variety of sources, including:PCB Manufacturers: Many PCB manufacturers specialize in metal core PCBs and can produce them according to your specifications. rocket  pcb https://www.rocket-pcb.com/ is an international, professional and reliable PCB manufacturer. If you have relevant needs, you are welcome to send us an inquiry.3. How to order metal core PCBWhen ordering metal core printed circuit boards, the following information must be provided:Board thickness: The thickness of the metal core PCB is an important consideration in the application. Please provide the thickness required for the application. Substrate: Specify the non-conductive substrate to be used for the metal core PCB, such as FR-4 or polyimide. Metal core material: Specify the metal core material to be used for the PCB, such as aluminum, copper, or iron. 0x9B9C] Specify the surface treatment to be used for the metal core PCB, such as surface treatment 0x9B9C] or ENIG Copper weight: Specify the weight of the copper layer to be used for the metal core PCB. Hole size and position: Provide the hole size and position required for your application. 0x9B9C] Color: Specify the color of the solder mask used for the metal core PCB. Silkscreen color: Specify the silkscreen color required for the metal core printed circuit board. Quantity: Specify the number of metal core PCBs required for your application.

In modern life, mobile phones seem to have become a necessity for people, and our daily lives are inseparable from them. Various activities such as communication, entertainment, shopping, and reading can all be accomplished through mobile phones, providing immense convenience to people's lives. It can be said that the compact mobile phone embodies the wisdom of modern civilization. The design of mobile phones has evolved from the initially bulky analog communication devices to today's powerful smart terminals. As smartphones rapidly advance towards thinner, lighter, higher-performance, and multifunctional designs, traditional rigid printed circuit boards (Rigid PCBs) and purely flexible printed circuit boards (Flex PCBs) can no longer meet the demands of complex designs. Semi-Rigid Flex PCBs, as a new circuit board technology that combines rigid and flexible areas, have become one of the core components in the design of modern high-end smartphones, thanks to their unique structural advantages.   1. What is a Semi-Rigid Flex PCB?A semi-rigid flex PCB is an advanced version of traditional rigid-flex PCBs. It is a printed circuit board that combines both rigid and flexible materials, built on a flexible base. This design allows specific parts of the PCB to bend or stretch while maintaining structural integrity in other areas. Essentially, it provides the stability of a rigid PCB along with the flexibility of a flex PCB within a single design.Semi-rigid flex PCBs are commonly used in applications that require complex 3D circuit layouts due to space constraints. However, the proper application of rigid-flex PCBs can be challenging. It requires ensuring smooth electrical connectivity within limited space while securely connecting components, ensuring polarity and contact stability, and ideally reducing the need for connectors for easier component integration.2. What Are the Advantages of Semi-Rigid Flex PCBs?Space SavingThe main advantages of rigid-flex PCBs include dynamic and mechanical stability, increased design flexibility in three-dimensional structures, simplified assembly, space savings, and consistent electrical performance. These PCBs can be bent or folded to fit into tight spaces, eliminating the need for connectors and reducing additional interconnects.Mechanical StabilitySemi-rigid flex PCBs offer high stability in applications requiring strong resistance to impact and vibration. Their design allows them to withstand mechanical stress, vibrations, and temperature fluctuations, making them highly durable with fewer potential failure points during use.High-Frequency Signal OptimizationThrough precise impedance control, semi-rigid flex PCBs reduce transmission loss in high-speed signals, such as those used in 5G and Wi-Fi 6 applications.3. What Are the Disadvantages of Semi-Rigid Flex PCBs?Higher CostSemi-rigid flex PCBs are generally more expensive than rigid or flexible PCBs due to their more complex manufacturing processes. Additionally, experienced PCB designers who specialize in rigid-flex designs are relatively scarce, increasing design costs.Higher Manual Assembly CostSince flexible conductive layers replace traditional wired interconnections, assembly steps and labor costs can be reduced. However, in some cases, this design can enhance the product's reliability and performance, which may help lower long-term maintenance costs despite the higher initial assembly expense.  4. What is the difference between Rigid-Flex PCB and Semi-Rigid Flex PCB?The main differences between Semi-Rigid Flex PCB and Rigid-Flex PCB lie in their structure, manufacturing methods, materials, and application scenarios: (1) StructureRigid-Flex PCBCombines rigid PCB (Rigid PCB) and flexible PCB (Flex PCB) through conductive layers and adhesive layers to form an integrated circuit board. The rigid sections provide structural support, while the flexible sections allow for bending. Semi-Rigid Flex PCBPrimarily consists of flexible PCB, but certain areas are made "semi-rigid" by adding thickened cover layers (such as FR4 laminates). Unlike Rigid-Flex PCBs, it does not directly combine rigid and flexible PCBs. (2) Manufacturing MethodsRigid-Flex PCBRequires a multi-layer lamination process, combining rigid materials (e.g., FR4) and flexible materials (e.g., Polyimide, PI). Semi-Rigid Flex PCBUses flexible materials and forms "semi-rigid" areas by locally adding FR4 or thickened cover layers. (3) MaterialsRigid-Flex PCBCombines FR4 (rigid sections) and Polyimide (PI, flexible sections) through lamination. Semi-Rigid Flex PCBPrimarily uses Polyimide (PI) flexible substrates, with certain areas reinforced by FR4 or other strengthening materials. However, it does not use complete rigid PCB layers. (4) BendabilityRigid-Flex PCBCan undergo dynamic bending in the flexible areas, making it suitable for applications requiring frequent folding or bending, such as foldable phones or medical devices. Semi-Rigid Flex PCBCan only be bent once during manufacturing to form a fixed shape. It cannot be repeatedly bent, as this may cause fractures. (5) Application Scenarios TypeApplication ScenariosRigid-Flex PCBDevices requiring repeated bending, such as foldable phones, camera modules,medical electronics, aerospace products, etc.Semi-Rigid Flex PCBCircuits requiring a specific shape without further bending, such as servers,communication equipment, military circuits, etc.  Summary:If you need a true combination of rigid and flexible sections, and the circuit board must still be bendable, choose Rigid-Flex PCB. If you only need to enhance the rigidity of certain areas of a flexible board without requiring dynamic bending, choose Semi-Rigid Flex PCB. 5. Integration of Semi-Rigid Flex PCB Technology with Smartphone ApplicationsThe bendability and technical characteristics of Semi-Rigid Flex PCBs make them highly suitable for smartphone applications. The rigid sections are used for mounting and supporting electronic components, while the flexible sections connect different modules, adapting to complex spatial layouts. This design not only enhances the reliability and durability of the circuit board but also significantly saves space, enabling more flexible and compact smartphone designs. Examples of Semi-Rigid Flex PCB Applications in Smartphones(1) Display Connection Application: In smartphones, Semi-Rigid Flex PCBs are commonly used to connect the display to the mainboard. The display is a critical component, and its connection to the mainboard requires high reliability and flexibility. Design: The rigid section of the Semi-Rigid Flex PCB is mounted on the mainboard, while the flexible section extends to the display module. This design allows the display to bend during opening and closing, reducing mechanical stress and extending the display's lifespan. Advantage: By using Semi-Rigid Flex PCBs, smartphone manufacturers can achieve thinner display designs while ensuring stable and reliable connections. (2) Camera Module Connection Application: Modern smartphones often feature multiple camera modules, including front-facing, rear-facing, and wide-angle cameras. These modules require efficient connections to the mainboard. Design: The rigid section of the Semi-Rigid Flex PCB is mounted on the mainboard, while the flexible section connects to each camera module. This design allows for fine adjustments of the camera modules inside the phone to accommodate different shooting angles and focal lengths. Advantage: By using Semi-Rigid Flex PCBs, smartphone manufacturers can achieve more flexible camera designs, improving photo and video quality. (3) Battery Connection Application: Smartphone batteries are typically located at the bottom or side of the device and require a connection to the mainboard via a circuit board. Design: The rigid section of the Semi-Rigid Flex PCB is mounted on the mainboard, while the flexible section extends to the battery module. This design allows for flexible battery placement, adapting to different shapes and sizes. Advantage: By using Semi-Rigid Flex PCBs, smartphone manufacturers can achieve more efficient battery layouts, ensuring stable power supply while saving internal space. (4) Antenna Connection Application: Smartphone antenna modules require efficient connections to the mainboard to ensure reliable signal reception and transmission. Design: The rigid section of the Semi-Rigid Flex PCB is mounted on the mainboard, while the flexible section connects to the antenna module. This design allows for flexible antenna placement, optimizing signal reception and transmission. Advantage: By using Semi-Rigid Flex PCBs, smartphone manufacturers can achieve more flexible antenna designs, improving communication quality and signal stability. (5) Sensor Connection Application: Smartphones are equipped with various sensors, such as accelerometers, gyroscopes, and ambient light sensors, which require efficient connections to the mainboard. Design: The rigid section of the Semi-Rigid Flex PCB is mounted on the mainboard, while the flexible section connects to each sensor module. This design allows for flexible sensor placement, ensuring accurate data collection. Advantage: By using Semi-Rigid Flex PCBs, smartphone manufacturers can achieve more flexible sensor layouts, enhancing overall performance and user experience. 6. Design Advantages of Semi-Rigid Flex PCBs(1) Space SavingSemi-Rigid Flex PCBs combine rigid and flexible sections, making full use of the internal space in smartphones. This reduces the need for traditional connectors and cables, enabling more compact and lightweight designs. (2) Enhanced ReliabilitySemi-Rigid Flex PCBs reduce the number of connectors and solder joints, lowering the failure rate and improving overall reliability. The flexible sections adapt to complex internal layouts, reducing mechanical stress and extending the device's lifespan. (3) Design FlexibilityThe flexible sections of Semi-Rigid Flex PCBs allow the circuit board to bend and fold within the smartphone, adapting to complex spatial layouts. This design flexibility enables manufacturers to create more innovative and diverse designs. (4) Cost EfficiencyAlthough the initial manufacturing cost of Semi-Rigid Flex PCBs is higher, their advantages in space saving, reliability, and design flexibility result in significant overall cost efficiency. By reducing the need for connectors and cables, assembly and maintenance costs are also lowered. 7. ConclusionAs a new circuit board technology, Semi-Rigid Flex PCBs are widely used in smartphones. By combining the advantages of rigid and flexible sections, Semi-Rigid Flex PCBs play a crucial role in display connections, camera module connections, battery connections, antenna connections, and sensor connections. Their benefits in space saving, reliability, design flexibility, and cost efficiency make them an indispensable part of modern smartphone design. With ongoing technological advancements, the application prospects for Semi-Rigid Flex PCBs in future smartphones and other electronic devices are even more promising.