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Rocket PCB hot-sale wire bonding surface finished for electronics

Rocket PCB hot-sale wire bonding surface finished for electronics

Rocket PCB hot-sale wire bonding surface finished for electronics

Name:
Gold wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Comparison
Closely following the market trend, Rocket PCB uses advanced production equipment and manufacturing technology to produce printed circuit board. The product receives favors from the majority of customers for the high quality and favorable price.Compared with other products in the same category, printed circuit board has the following competitive advantages.
Company Advantages
1. Rocket PCB ic wire bonding is available in an attractive design and appealing finish.
2. The product is 100% hygienic. Being fired at very high temperatures to guarantee 100% non-porous, it has a very smooth and resistant surface against grease, odors, and bacteria.
3. Rocket PCB Solution Ltd. is able to accomplish the production tasks with nice quality and quantity.
4. We have great confidence in our wire bonding quality.

methods

Rocket PCB hot-sale wire bonding surface finished for electronics-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
Rocket PCB hot-sale wire bonding surface finished for electronics-4                
Communications
Rocket PCB hot-sale wire bonding surface finished for electronics-5                
Energy
Rocket PCB hot-sale wire bonding surface finished for electronics-6                
Industrial & Instrumentation
Rocket PCB hot-sale wire bonding surface finished for electronics-7                
IOT/Smart Home
Rocket PCB hot-sale wire bonding surface finished for electronics-8                
Medical electronics
Rocket PCB hot-sale wire bonding surface finished for electronics-9                
Security Industry

Company Features
1. From the beginning of the brand's creation, Rocket PCB Solution Ltd. has focused on the innovative development of wire bonding .
2. Rocket PCB tries to ensure the quality of printed circuit board industry.
3. Rocket PCB Solution Ltd. firmly believes that quality is above everything else. Get an offer! With the support of our professional and technical personnel, Rocket PCB Solution Ltd. has enough confidence to make reliable wire bonding pcb . Get an offer! The goal of Rocket PCB is to influence global markets by manufacturing wire bonding process . Get an offer!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!