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Rocket PCB gold wire bonding bulk fabrication for digital device

Rocket PCB gold wire bonding bulk fabrication for digital device

Rocket PCB gold wire bonding bulk fabrication for digital device

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB gold wire bonding bulk fabrication for digital device
Product Details
We are confident about the exquisite details of PCB prototyping.Well-chosen in material, fine in workmanship, excellent in quality and favorable in price, Rocket PCB's PCB prototyping is highly competitive in the domestic and foreign markets.
Enterprise Strength
  • Logistics plays a key role in Rocket PCB's business. We constantly promote the specialization of logistics service and build a modern logistics management system with advanced logistics information technique. All these ensure that we could provide efficient and convenient transportation.
Company Advantages
1. The uninterrupted and fine production process of Rocket PCB wire bonding is ensured by all our members working in perfect coordination with each other.
2. The product is highly demanded across the globe for its vast features & specifications.
3. Over the years, this product has received a good reputation from our customers.

methods


Rocket PCB gold wire bonding bulk fabrication for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB gold wire bonding bulk fabrication for digital device-2                
Consumer electronics
Rocket PCB gold wire bonding bulk fabrication for digital device-3                
Automotive electronics
Rocket PCB gold wire bonding bulk fabrication for digital device-4                
Communications
Rocket PCB gold wire bonding bulk fabrication for digital device-5                
Energy
Rocket PCB gold wire bonding bulk fabrication for digital device-6                
Industrial & Instrumentation
Rocket PCB gold wire bonding bulk fabrication for digital device-7                
IOT/Smart Home
Rocket PCB gold wire bonding bulk fabrication for digital device-8                
Medical electronics
Rocket PCB gold wire bonding bulk fabrication for digital device-9                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. has developed to a large manufacturing company that produces wire bonding .
2. Rocket PCB Solution Ltd. has successfully got several patents for technology.
3. Rocket PCB Solution Ltd. is guided by the enterprise tenet of 'product innovation and technology leadership'. Inquiry! Persist in striving to create ic wire bonding for the world is a principle of Rocket PCB. Inquiry! Rocket PCB Solution Ltd. will continue to strengthen technological innovation to enhance the overall competitive advantage in the international wire bonding technology industry. Inquiry!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!