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Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device

Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device

Name:
Gold wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device
Company Advantages
1. The manufacturing process for the materials of Rocket PCB aluminum wire bonding process includes many steps that determine the precise set of properties for the finished product, such as wrinkle resistance and colorfastness. The product allows the installation and repair process to be convenient
2. There are no unsafe materials contained in it, and people do not worry that it will cause allergic or sensitive skin due to inferior quality. It is specifically designed to lessen the chances of shorts and wiring issues
3. Verified by the production, aluminum wire bonding process features reasonable structure, high efficiency and notable economic benefits. The product features low electric currents and radiation emission

methods

Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device-4                
Communications
Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device-5                
Energy
Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device-6                
Industrial & Instrumentation
Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device-7                
IOT/Smart Home
Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device-8                
Medical electronics
Rocket PCB finished aluminum wire bonding process bulk fabrication for digital device-9                
Security Industry

Company Features
1. For a long time, Rocket PCB has always attached great importance to the core value of technological power.
2. As a fast-growing company, we work to develop and maintain sustainable relationships with all stakeholders. We demonstrate this commitment by acting imaginatively and consistently in the communities where our employees, business partners, and customers live and work.
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