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pcb prototyping hot-sale for sale Rocket PCB

Pcb prototyping hot-sale for sale Rocket PCB

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Company Advantages
1. Rocket PCB pcb prototyping meets the industry safety standards for electrical devices. It has been tested to prove that its electromagnetic disturbance level, electrostatic discharge, and electric leakage control are within the stipulated limit. It reduces the component welding points and is possible in the reduction of the failure rate
2. The product has won the common recognition since its wide application prospects have been praised by many customers. It is the perfect choice for manufacturers of electronic components, instruments, and equipment
3. The product features a smooth surface. During the polishing stage, the sand holes, air blisters, pocking mark, burrs, or black spots have been all removed. The product reduces the possibility of loose connections or short circuit
4. The product has exquisite seamless joints. Its parts are seamed with high precision machines that will not generate ugly splicing trace. It takes less time in assembling a circuit as compared to the conventional method


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





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EXTENSIVE ANALYTICAL TESTINGpcb prototyping hot-sale for sale Rocket PCB-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. works as a supplier of high quality pcb manufacturing process products. Solid technical foundation makes Rocket PCB Solution Ltd. stands out in the any-layer pcb industry.
2. Advanced equipment plays an important role to the high quality double layer pcb of Rocket PCB Solution Ltd..
3. Rocket PCB Solution Ltd. constantly improves the product manufacturing process. Rocket PCB Solution Ltd. is committed to trust, honesty and responsibility, whether internal or external. Get an offer!
Extensive tests for Rocket PCB double layer pcb have been conducted. It has been tested in terms of flex and fatigue, cushioning and shock absorption, perforation, and biomechanical comfort. This product can achieve a concealed installation
Rocket PCB pcb manufacturing process is inspected in a strict manner. Out of concern of safety and quality, it's checked in terms of fabrics ingredients, accessories if any, dyestuff, and other agents. This product is suitable for single- and double-leaf doors
There are careful material selections in Rocket PCB any-layer pcb manufacture. The materials are selected mainly in consideration of the force exerted on the element and the production cost. This product is able to maintain a hold-open statue
Rocket PCB pcb prototyping is tested in terms of performance and manufacturing quality. It has passed various tests, such as anti-bacterial testing, temperature resistance, colorfastness, tensile strength, and wear resistance. This product enjoys a broad range of applications in residential and commercial projects
Rocket PCB pcb prototyping goes through reasonable designing. Human factors data such as ergonomics, anthropometrics, and proxemics are well applied in the design phase. Thanks to the special anti-corrosion protection, this product can withstand harsh conditions
The product can run under extreme conditions. All its components and the electrode leader are inflicted with a certain electric pressure to test its voltage resistance and insulation performance. It can be used for almost all door sizes and areas of application
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!