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fabrication wire bonding pcb bulk fabrication for digital device Rocket PCB

fabrication wire bonding pcb bulk fabrication for digital device Rocket PCB

Fabrication wire bonding pcb bulk fabrication for digital device Rocket PCB

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of fabrication wire bonding pcb bulk fabrication for digital device Rocket PCB
Application Scope
Rocket PCB's HDI PCB can be used in many industries.In addition to providing high-quality products, Rocket PCB also provides effective solutions based on the actual conditions and the needs of different customers.
Product Comparison
Good materials, advanced production technology, and fine manufacturing techniques are used in the production of PCB prototyping. It is of fine workmanship and good quality and is well sold in the domestic market.Compared with other products in the same category, PCB prototyping has outstanding advantages which are mainly reflected in the following points.
Company Advantages
1. Rocket PCB wire bonding pcb is manufactured adopting advanced machines. These machines mainly include punching machine, bending machine, stamping machine, milling machine, cutting machine, etc.
2. This product will be one of the biggest visual elements in the bedroom. Luckily, it is always available in varieties of colors and patterns to match up any bedroom.
3. One of its conveniences is that this product is a bit anti-fouling and can be machine washed and properly launder.
4. Your own company logo is acceptable to print on cartons of wire bonding pcb .
5. Rocket PCB has been trying its best to provide the best customer service also including the after-sale service.

methods


fabrication wire bonding pcb bulk fabrication for digital device Rocket PCB-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. holds a paramount position in Chinese wire bonding pcb market.
2. All wire bonding process are certified to aluminum wire bonding process .
3. Rocket PCB Solution Ltd. is guided by the enterprise tenet of 'product innovation and technology leadership'. Get quote! Rocket PCB Solution Ltd.'s goal is to provide better and more suitable industrial products and services. Get quote!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!