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stagger pcb manufacturing process at discount bulk production

Stagger pcb manufacturing process at discount bulk production

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Enterprise Strength
  • Rocket PCB always adheres to the service concept of 'quality first, customer first'. We return society with high-quality products and thoughtful services.
Product Details
Rocket PCB adheres to the principle of 'details determine success or failure' and pays great attention to the details of PCB prototyping.Rocket PCB has professional production workshops and great production technology. PCB prototyping we produce, in line with the national quality inspection standards, has reasonable structure, stable performance, good safety, and high reliability. It is also available in a wide range of types and specifications. Customers' diverse needs can be fully fulfilled.
Company Advantages
1. pcb manufacturing process generates a sound image of exceptional quality.
2. The product is resistant to high temperature. It has been fired or sintered under very high temperature, and it has a high melting point.
3. This product is good for promotional items and newly released products. It is useful for both large and small items and can be put outdoors or indoors.
4. This garment is ideal for people who want to impress other people. It could help one feel more professional and confident as he or she wears it.
5. This antibacterial product can radically reduce bacterial infections contracted from contact surfaces, hence to create a clean and hygienic surrounding for people.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Due to the high-quality workmanship of HDI PCB fabrication, Rocket PCB Solution Ltd. has been greatly appreciated in the market.
2. We've got power in human assets, especially in the R&D sector. The R&D talents are imaginative, creative, and professional in industry know-how to develop products based on current industry niches or trends.
3. Rocket PCB will never rest on ready-made achievements but always seek better development. Get an offer! To Rocket PCB Solution Ltd., providing best service for customers is what we should sticks to. Get an offer! pcb manufacturing process is the gene of Rocket PCB which is the driving force to continue to develop its business. Get an offer!
The manufacture of Rocket PCB HDI PCB fabrication involves several necessary procedures. These procedures include pattern design, cutting, stitching, attaching the soles, and assembling.
After years of improvement, the design of Rocket PCB HDI PCB fabrication is loved by artists and professionals and it provides a feeling of writing, signing, or drawing naturally, allowing users to focus on what really matters.
Rocket PCB pcb manufacturing process has been tested many times to meet regulatory requirements. These tests include dimensional stability, colorfastness, abrasion or pilling, etc.
As it is an essential part of the production process, the samples of Rocket PCB HDI PCB fabrication are carefully handled to ensure that the feel and look are right for customers' brand.
Rocket PCB HDI PCB fabrication is designed with high technology. Adopting the brand new CAD lofting software which is especially for inflatable products, the design drawing comes out within minutes.
Product quality in line with industry standards, and through the international certification.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!