Stagger pcb manufacturing process at discount bulk production

Company Advantages
1. pcb manufacturing process generates a sound image of exceptional quality.
2. The product is resistant to high temperature. It has been fired or sintered under very high temperature, and it has a high melting point.
3. This product is good for promotional items and newly released products. It is useful for both large and small items and can be put outdoors or indoors.
4. This garment is ideal for people who want to impress other people. It could help one feel more professional and confident as he or she wears it.
5. This antibacterial product can radically reduce bacterial infections contracted from contact surfaces, hence to create a clean and hygienic surrounding for people.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

The technology of making any layer HDI is summarized as follows

1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.

Company Features
1. Due to the high-quality workmanship of HDI PCB fabrication, Rocket PCB Solution Ltd. has been greatly appreciated in the market.
2. We've got power in human assets, especially in the R&D sector. The R&D talents are imaginative, creative, and professional in industry know-how to develop products based on current industry niches or trends.
3. Rocket PCB will never rest on ready-made achievements but always seek better development. Get an offer! To Rocket PCB Solution Ltd., providing best service for customers is what we should sticks to. Get an offer! pcb manufacturing process is the gene of Rocket PCB which is the driving force to continue to develop its business. Get an offer!