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Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

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◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

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EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

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FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

p******z

Extensive tests for Rocket PCB pcb prototyping have been conducted. It has been tested in terms of flex and fatigue, cushioning and shock absorption, perforation, and biomechanical comfort.

t******n

Rocket PCB any-layer pcb is inspected in a strict manner. Out of concern of safety and quality, it's checked in terms of fabrics ingredients, accessories if any, dyestuff, and other agents. Its timeless design makes it never go out of date

r******c

There are careful material selections in Rocket PCB any-layer pcb manufacture. The materials are selected mainly in consideration of the force exerted on the element and the production cost. With an adjustable backcheck, it provides cushioning when the door is abusively opened

m******q

Rocket PCB pcb prototyping is tested in terms of performance and manufacturing quality. It has passed various tests, such as anti-bacterial testing, temperature resistance, colorfastness, tensile strength, and wear resistance. Thanks to the special anti-corrosion protection, this product can withstand harsh conditions

h******d

Rocket PCB pcb prototyping goes through reasonable designing. Human factors data such as ergonomics, anthropometrics, and proxemics are well applied in the design phase. This product comes in variable models for a wide range of applications

c******c

The product can run under extreme conditions. All its components and the electrode leader are inflicted with a certain electric pressure to test its voltage resistance and insulation performance. Using high-quality aluminum-alloy materials, its body resists oxidation

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Stagger any-layer pcb free sample for wholesale

Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application