stagger any-layer pcb free sample for wholesale

Latest products

High density HDI PCB 4+N+4 HDI PCB board manufacturing

Double Sided PCB prototyping FR4 2-layer PCB fast turn

PET FCCL PCB

PCB prototyping

Product Information
Feedback

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

stagger any-layer pcb free sample for wholesale-1

stagger any-layer pcb free sample for wholesale-2

Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

stagger any-layer pcb free sample for wholesale-3

Anylayer PCB DFM suggestion for layout

stagger any-layer pcb free sample for wholesale-4

stagger any-layer pcb free sample for wholesale-5

Product FEATURES

stagger any-layer pcb free sample for wholesale-6

◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

stagger any-layer pcb free sample for wholesale-7

SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

stagger any-layer pcb free sample for wholesale-8

CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

stagger any-layer pcb free sample for wholesale-9

EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

stagger any-layer pcb free sample for wholesale-11

FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

stagger any-layer pcb free sample for wholesale-12

Consumer electronics

stagger any-layer pcb free sample for wholesale-13

Automotive electronics

stagger any-layer pcb free sample for wholesale-14

Communications

stagger any-layer pcb free sample for wholesale-15

Energy

stagger any-layer pcb free sample for wholesale-16

Industrial & Instrumentation

stagger any-layer pcb free sample for wholesale-17

IOT/Smart Home

stagger any-layer pcb free sample for wholesale-18

Medical electronics

stagger any-layer pcb free sample for wholesale-19

Security Industry

a******q

Strict inspection of Rocket PCB any-layer pcb involves different aspects. For example, its insulation materials will be inspected in terms of arc resistance and electric leakage resistance which may form a conductive path or cause mechanical damage. Established in 2014, Foshan Polyva materials CO., Ltd. specializes in development, manufacture and supply of water soluble PVA film

j******z

Rocket PCB any-layer pcb meets the basic technical specifications for safety of textiles. It is produced under strict quality scrutinization by the QC team in terms of its material ingredients, agents, and processing techniques. The adopted materials are all harmless which do no harm to human body

d******o

Rocket PCB pcb prototyping is the outcome of state-of-the-art technology. It is manufactured under such technologies as 3D composite knitting, 3D weaving, and modern electrostatic nanometer mesh technology. Water- soluble packaging bags are light which reduce the transportation cost

r******g

Rocket PCB any-layer pcb is manufactured under the inspection of the QC team. It is checked in all aspects to make sure it meets the standards for indoor decorating and refurbishing materials. Fast delivery can be guaranteed

i******u

The quality of Rocket PCB any-layer pcb is guaranteed by a series of tests. It has gone through inspection on its seam force, tensile strength, fiber stiffness, fiber resilience, etc. The adopted materials are all harmless which do no harm to human body

s******j

Strict quality inspection ensures the quality of products. Water- soluble packaging bags can be also applied as a pesticide packaging that greatly reduces the incidence of pesticide poisoning

Product Message

*Name

Phone

*E-mail

*Content

Stagger any-layer pcb free sample for wholesale

Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application