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stacked pcb manufacturing process hot-sale precision at discount

Stacked pcb manufacturing process hot-sale precision at discount

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Company Advantages
1. Rocket PCB HDI PCB fabrication has passed a wide range of tests. It has been tested in terms of resistance to water penetration, fuel oil, fat, hot contact, discoloration, color transfer, and cracking. It is specifically designed to lessen the chances of shorts and wiring issues
2. Rocket PCB has acquired the certifications of pcb manufacturing process, and provides one-stop solution with quality inspection. It reduces the need for interconnecting wiring
3. pcb manufacturing process has many advantages, such as HDI PCB fabrication. The product brings reliability in the performance of the circuit


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





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EXTENSIVE ANALYTICAL TESTINGstacked pcb manufacturing process hot-sale precision at discount-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. With years of concentration on the design and production of HDI PCB fabrication, Rocket PCB Solution Ltd. has been considered as one of the most trustworthy manufacturers.
2. Rocket PCB Solution Ltd. has a professional level and mature technology to participate in the production of high quality products.
3. We insist on sustainability. To promote safe, secure and sustainable living and working environments, we always apply science-based safety manufacturing.
Different machining approaches are used in processing mechanical parts of Rocket PCB pcb manufacturing process. These mechanical parts, including engine, motor, and hydraulic components, will go through thermal treatment, honing machining, or wire cutting based on their actual usages and structures. Located in Nanhai High-tech Zone, our factory covers 3300 square meters with over 60 employees
The production of Rocket PCB HDI PCB fabrication involves the following major steps. It has to go through stamping, coating, painting, drying, and polishing by respective machines. The PVA water soluble film can be widely applied like pesticide packing, medical laundry bags and so on
Rocket PCB pcb manufacturing process is designed by our professional designers who strive to achieve economical and efficient mechanical performance, including operational stability, structure reliability, and operation efficiency, etc. Our products have passed ISO9001 quality management system certificate
Rocket PCB pcb manufacturing process is designed considering its operation processes. They include stress points, support points, yield points, wear resistance, toughness, friction force, etc. The film Ployva produces enjoys excellent compatibility with liquid detergents
Rocket PCB HDI PCB fabrication is guaranteed with a high safety level. During the designing stage, various elements considering its safety are seriously considered, including electrical safety, mechanical security, and personal safety of operators. The adopted materials are all harmless which do no harm to human body
The product features high precision. The machines are equipped with control probes that allow the dimensions to be checked while the piece is still in the machine, thus avoiding repositioning that would decrease the required precision. Water soluble film can also be tested and verified by professional authority
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!