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High density HDI PCB 4+N+4 HDI PCB board manufacturing

Double Sided PCB prototyping FR4 2-layer PCB fast turn

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Product Comparison

Rocket PCB has great production capability and excellent technology. We also have comprehensive production and quality inspection equipment. printed circuit board has fine workmanship, high quality, reasonable price, good appearance, and great practicality.printed circuit board in Rocket PCB has the following advantages, compared with same kind of products in the market.

Company Advantages
1. The quality of Rocket PCB HDI PCB fabrication is guaranteed. It is made by professionals who have extensive knowledge in dyeing, sewing, computer-aided design, garment construction and tailoring.
2. This product feels soft and has many other amazing qualities such as hypoallergenic material and moisture wicking & anti-microbial fabric.
3. The product is notable for high energy efficiency. When it operates, it can utilize little energy as possible without any waste.
4. With such a high aesthetic function, the product will absolutely increase the value and enhance the appeal of the houses or other buildings.
5. Our customers praise that the product has good structure strength, and it will not easily fray or rupture even our customers stretch it.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

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◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

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EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

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FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is the leading manufacturer of pcb manufacturing process with advanced production machines.
2. Rocket PCB attaches great importance to forward-looking technology applications in the production of any-layer pcb .
3. Rocket PCB Solution Ltd. has made full preparation to meet up with all victories or challenges. Call now! Rocket PCB Solution Ltd. is professional and loyal to exceeding our customer's vision. Call now! It is Rocket PCB Solution Ltd.'s goal to seek the excellent quality. Call now! To be one of the advanced double layer pcb manufacturer is the hope of Rocket PCB. Call now!

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Thanks to the low cost of raw materials and the high efficiency of streamlined production, double layer pcb products have the advantage of high gross profit margin. Its components are always soldered in, which contributes to durability

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Rocket PCB double layer pcb comes in a variety of wonderful designs. Its assembly process is conducted by a computer, leaving very little room for error

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High technical assurance and first-class quality can be seen on pcb manufacturing process. It improves the wiring density and reduces the spacing of components

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All raw materials used to manufactured Rocket PCB HDI PCB fabrication have to go through stringent quality checking procedure. Its connections made automatically through copper tracks

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The design of Rocket PCB any-layer pcb focuses on the technique and function.

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any-layer pcb has advantages both in cost, reliability and long life, in comparison with other similar products. It makes the interconnections less bulky

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Stacked pcb manufacturing process hot-sale fabrication at discount

Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application