Rocket PCB  > 

AI - Page Sitemap

 > 

stacked pcb manufacturing process free sample fabrication

stacked pcb manufacturing process free sample fabrication

Stacked pcb manufacturing process free sample fabrication

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of stacked pcb manufacturing process free sample fabrication
Product Comparison
Rocket PCB insists on the use of high-quality materials and advanced technology to manufacture PCB maker. Besides, we strictly monitor and control the quality and cost in each production process. All this guarantees the product to have high quality and favorable price.Rocket PCB's PCB maker is produced in strict accordance with standards. We make ensure that the products have more advantages over similar products in the following aspects.
  • v s
Company Advantages
1. The whole production of Rocket PCB HDI PCB fabrication is handled by our professional production team using the advanced technology and equipment.
2. The product is valued for their features like durability, long-lasting functionality, and long service life.
3. Rocket PCB Solution Ltd.'s product performance is stable, price is reasonable and after-sales service good. .
4. Rocket PCB Solution Ltd. has been prospering for its considerate service for customers.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



stacked pcb manufacturing process free sample fabrication-1





stacked pcb manufacturing process free sample fabrication-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




stacked pcb manufacturing process free sample fabrication-3



Anylayer PCB DFM suggestion for layout


stacked pcb manufacturing process free sample fabrication-4

stacked pcb manufacturing process free sample fabrication-5



Product FEATURES


stacked pcb manufacturing process free sample fabrication-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

stacked pcb manufacturing process free sample fabrication-7


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

stacked pcb manufacturing process free sample fabrication-8


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





stacked pcb manufacturing process free sample fabrication-9

EXTENSIVE ANALYTICAL TESTINGstacked pcb manufacturing process free sample fabrication-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



stacked pcb manufacturing process free sample fabrication-11


FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


stacked pcb manufacturing process free sample fabrication-12                
Consumer electronics
stacked pcb manufacturing process free sample fabrication-13                
Automotive electronics
stacked pcb manufacturing process free sample fabrication-14                
Communications
stacked pcb manufacturing process free sample fabrication-15                
Energy
stacked pcb manufacturing process free sample fabrication-16                
Industrial & Instrumentation
stacked pcb manufacturing process free sample fabrication-17                
IOT/Smart Home
stacked pcb manufacturing process free sample fabrication-18                
Medical electronics
stacked pcb manufacturing process free sample fabrication-19                
Security Industry

Company Features
1. Rocket PCB is an economic entity which is professional in the production of pcb manufacturing process.
2. Quality is above everything in Rocket PCB Solution Ltd..
3. Rocket PCB Solution Ltd. always walks on the road to excellence in thew field of any-layer pcb . Contact us! Customer trust is the driving force for excellence in Rocket PCB Solution Ltd.. Contact us! Rocket PCB Solution Ltd. can provide the best choice according to your needs. Contact us!
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...
Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!