stacked pcb manufacturing process free sample fabrication

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Rocket PCB insists on the use of high-quality materials and advanced technology to manufacture PCB maker. Besides, we strictly monitor and control the quality and cost in each production process. All this guarantees the product to have high quality and favorable price.Rocket PCB's PCB maker is produced in strict accordance with standards. We make ensure that the products have more advantages over similar products in the following aspects.

Company Advantages
1. The whole production of Rocket PCB HDI PCB fabrication is handled by our professional production team using the advanced technology and equipment.
2. The product is valued for their features like durability, long-lasting functionality, and long service life.
3. Rocket PCB Solution Ltd.'s product performance is stable, price is reasonable and after-sales service good. .
4. Rocket PCB Solution Ltd. has been prospering for its considerate service for customers.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

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◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

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EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

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FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

Company Features
1. Rocket PCB is an economic entity which is professional in the production of pcb manufacturing process.
2. Quality is above everything in Rocket PCB Solution Ltd..
3. Rocket PCB Solution Ltd. always walks on the road to excellence in thew field of any-layer pcb . Contact us! Customer trust is the driving force for excellence in Rocket PCB Solution Ltd.. Contact us! Rocket PCB Solution Ltd. can provide the best choice according to your needs. Contact us!

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Thanks to the low cost of raw materials and the high efficiency of streamlined production, HDI PCB fabrication products have the advantage of high gross profit margin. It is the perfect choice for manufacturers of electronic components, instruments, and equipment

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Rocket PCB pcb manufacturing process comes in a variety of wonderful designs. Its simple design makes it easier for users to maintain and manipulate

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High technical assurance and first-class quality can be seen on any-layer pcb. The product reduces the possibility of loose connections or short circuit

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All raw materials used to manufactured Rocket PCB any-layer pcb have to go through stringent quality checking procedure. It offers a simple platform to arrange the electronic components in a compressed way

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The design of Rocket PCB any-layer pcb focuses on the technique and function. Its connections made automatically through copper tracks

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HDI PCB fabrication has advantages both in cost, reliability and long life, in comparison with other similar products. The electronic components and their polarities on it are clearly labeled

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Stacked pcb manufacturing process free sample fabrication

Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application