Stacked double layer pcb free sample precision at discount

Company Advantages
1. The main components of double layer pcb are made from imported materials. It takes less time in assembling a circuit as compared to the conventional method
2. Over the years in the market, this product has received no complaints from our customers. It is hard to find any short circuits in this product
3. The product is extremely ergonomic. Its ergonomic shape of hugs the natural curve of the back distributing the weight evenly. It offers a simple platform to arrange the electronic components in a compressed way
4. The product will not contaminate the food during the dehydration. There is a defrosting tray to collect the water vapor which may drop to the food. Thanks to the application of the shielding layer, its signal distortion is reduced
5. The product has a superior appearance. It is innovatively designed with visual impact and has a high-gloss finish that is provided by RTM technology.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

The technology of making any layer HDI is summarized as follows

1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.

Company Features
1. Rocket PCB Solution Ltd.'s production of double layer pcb is in the leading position nationwide.
2. Rocket PCB Solution Ltd. has strong financial, professional and technical strength.
3. Our value is: we accept personal responsibility for our actions and focus on finding solutions and delivering results. We keep our promises and commitments.