Stacked double layer pcb at discount layer for wholesale

Company Advantages
1. Backed by our rich industry experience and market understanding, Rocket PCB double layer pcb is endowed with an innovative and well-received design.
2. Outstanding pressure sensitivity: the product is the result of patented technology. It allows the accurate capture of every handwritten stroke once the hand or stylus touches the screen.
3. The product has a reliable electrical system. It will auto stop working when open circuit, short circuit, and electric leakage occurs.
4. It is created not only to fulfill the ambitions of customers but also to add value to their business.
5. The product is applicable with high efficiency.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

The technology of making any layer HDI is summarized as follows

1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.

Company Features
1. Rocket PCB has enough strength to produce high quality double layer pcb with competitive price.
2. We have professional designers who are qualified with abundant experience. They can provide designing, sample making, and full-production services for customers, and can handle clients' projects in a more professional and effective way.
3. A mutual goal helps Rocket PCB to develop better. Contact us! Rocket PCB Solution Ltd. will set up a management mode that takes the customer's demand as the direction. Contact us! Rocket PCB is positioned to provide any-layer pcb and adheres to the concept of providing all-round services for customers. Contact us! Rocket PCB Solution Ltd. strives to create brands with market appeal and market competitiveness! Contact us!