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stacked any-layer pcb at discount pcb bulk production

Stacked any-layer pcb at discount pcb bulk production

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Company Advantages
1. The production of Rocket PCB consists of two parts, making processing such as extrusion, die casting, and stamping, as well as the deep process such as drilling, milling, and welding. It takes less time in assembling a circuit as compared to the conventional method
2. The product keeps the devices from the damage caused by over high temperature or overheats, hence, it extends the service life of the device. Its compact design takes less space in a piece of application equipment
3. With the advantages of , any-layer pcb is thought to be an optimal . It reduces the component welding points and is possible in the reduction of the failure rate
4. After comparison with other products, such conclusion can be made that any-layer pcb is superior with . The product is widely applied in consumer electronics
5. Owing to , Rocket PCB has gained much more popularity than before. The product reduces the possibility of loose connections or short circuit


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





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EXTENSIVE ANALYTICAL TESTINGstacked any-layer pcb at discount pcb bulk production-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. With years of exploration, Rocket PCB Solution Ltd. has grown into a qualified manufacturer, specializing in design, manufacture, distribution of . Rocket PCB Solution Ltd. has superior equipment and advanced process for any-layer pcb production.
2. Produced by technology, our custom circuit board manufacturers are of high performance for its finest quality.
3. The entire production of double layer pcb meets up with and safety standard. We will comply with all applicable legal and regulatory requirements regarding environmental protection. We only discharge wastes or effluent that proven to be harmless by technology.
The design of Rocket PCB custom circuit board manufacturers is strictly conducted. It is carried out by our designers who think highly of parts and components safety, the whole machine safety, operation safety, and environmental safety. It can be tailored to meet the specific requirements of customers
The necessary tests for Rocket PCB double layer pcb have been strictly conducted. It has been tested in terms of safety, electromagnetic compatibility, vibration, reliability, and durability. The product is lightweight and is easy to carry
The design of Rocket PCB custom circuit board manufacturers involves many considerations. They may include stress points, support points, yield points, wear resistance capacity, toughness, and friction force. This product can be installed at any predetermined pressure
Before delivery, Rocket PCB double layer pcb has to undergo a wide range of tests. It is strictly tested in terms of the strength of its materials, statics&dynamics performance, resistance to vibrations&fatigue, etc. The product is lightweight and is easy to carry
The manufacture of Rocket PCB any-layer pcb involves some critical processes. These stages include concept confirmation, metal materials procurement, frame fabrication, components machining, surface painting, and final assembly. The product is suitable for most liquids and liquefied gases
The product has stable operating pressure. During the operation, the pump depletion phenomenon is eliminated to avoid dry friction or damage to sealing. This product has the advantages of speed and efficiency
Product Message
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