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Rocket PCB finished wire bonding bulk fabrication for automotive

Rocket PCB finished wire bonding bulk fabrication for automotive

Rocket PCB finished wire bonding bulk fabrication for automotive

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Enterprise Strength
  • Rocket PCB is equipped with a professional service team. We are dedicated to providing customers with professional and efficient services.
Product Comparison
Rocket PCB is certified by various qualifications. We have advanced production technology and great production capability. pcb fabrication has many advantages such as reasonable structure, excellent performance, good quality, and affordable price.Compared with other products in the same category, pcb fabrication has the following competitive advantages.
Company Advantages
1. The deft design of wire bonding has attracted more and more customers.
2. This product has reliable quality and stable performance.
3. Our presented product has a longer service life and durability.
4. Features of this product will reward viewers with a bright projected image. When one uses this product to see the movie for the first time, they will recognize its value quickly.
5. The product helps reduce the work burden. It keeps the employees refreshed and prevents them from burning out, which will help maintain business productivity.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB finished wire bonding bulk fabrication for automotive-1


methods


Rocket PCB finished wire bonding bulk fabrication for automotive-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Rocket PCB finished wire bonding bulk fabrication for automotive-3



Product application


Rocket PCB finished wire bonding bulk fabrication for automotive-4                
Consumer electronics
Rocket PCB finished wire bonding bulk fabrication for automotive-5                
Automotive electronics
Rocket PCB finished wire bonding bulk fabrication for automotive-6                
Communications
Rocket PCB finished wire bonding bulk fabrication for automotive-7                
Energy
Rocket PCB finished wire bonding bulk fabrication for automotive-8                
Industrial & Instrumentation
Rocket PCB finished wire bonding bulk fabrication for automotive-9                
IOT/Smart Home
Rocket PCB finished wire bonding bulk fabrication for automotive-10                
Medical electronics
Rocket PCB finished wire bonding bulk fabrication for automotive-11                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. owns a large production base and professional R&D team for wire bonding .
2. Our company has outstanding workers. With a high degree of dedication, strong professional qualifications and a high degree of motivation, they always have the ability to provide customers with the most suitable products.
3. Rocket PCB products has met the market demand at home and abroad. Welcome to visit our factory! Rocket PCB Solution Ltd. has a standard raw material inspection procedure.
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!