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Rocket PCB fabrication wire bonding wire for digital device

Rocket PCB fabrication wire bonding wire for digital device

Rocket PCB fabrication wire bonding wire for digital device

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Comparison
Rocket PCB has professional production workshops and great production technology. HDI PCB we produce, in line with the national quality inspection standards, has reasonable structure, stable performance, good safety, and high reliability. It is also available in a wide range of types and specifications. Customers' diverse needs can be fully fulfilled.Compared with products in the same category, Rocket PCB's HDI PCB has the following outstanding features.
Company Advantages
1. Rocket PCB semiconductor wire bonding is fabricated using the best grade raw material and sophisticated technology.
2. The operation process of this product is stable and reliable owing to the reasonably designed and arranged components and parts.
3. The product has the advantage of high precision. The materials used are perfectly cut to the required dimensions using CNC saws.
4. The product has considerable durability. People who have bought it for many years all said that it is long-lasting and hard-wearing.
5. The advantages of purchasing this product that is easy to use include having it monitor patients' health, providing the appropriate health care.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB fabrication wire bonding wire for digital device-1


methods


Rocket PCB fabrication wire bonding wire for digital device-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Rocket PCB fabrication wire bonding wire for digital device-3



Product application


Rocket PCB fabrication wire bonding wire for digital device-4                
Consumer electronics
Rocket PCB fabrication wire bonding wire for digital device-5                
Automotive electronics
Rocket PCB fabrication wire bonding wire for digital device-6                
Communications
Rocket PCB fabrication wire bonding wire for digital device-7                
Energy
Rocket PCB fabrication wire bonding wire for digital device-8                
Industrial & Instrumentation
Rocket PCB fabrication wire bonding wire for digital device-9                
IOT/Smart Home
Rocket PCB fabrication wire bonding wire for digital device-10                
Medical electronics
Rocket PCB fabrication wire bonding wire for digital device-11                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. has became the global market leader as a supplier of wire bonding .
2. When it comes to wire bonding pcb quality, wire bonding process is proud of it.
3. Rocket PCB Solution Ltd. has built mature after-sale system to better serve every customer. Get quote! Rocket PCB Solution Ltd. will design and provide the perfect printed circuit board industry for you according to your needs. Get quote! Rocket PCB is looking forward to cooperating with you for our high quality wire bonding technology . Get quote! Rocket PCB Solution Ltd. aims to build a safe and economic environment of wire bonding industry. Get quote!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!