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Professional Gold wire bonding pcb bonging pad PCB fabrication

Professional Gold wire bonding pcb bonging pad PCB fabrication

Gold wire bonding PCB
gold wire,aluminum wire
Board thickness:
Surface treatment:
Immersion Gold
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
L/C,T/T,Western Union
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
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Product Details
With the pursuit of perfection, Rocket PCB exerts ourselves for well-organized production and high-quality printed circuit board.Rocket PCB carefully selects quality raw materials. Production cost and product quality will be strictly controlled. This enables us to produce printed circuit board which is more competitive than other products in the industry. It has advantages in internal performance, price, and quality.
Application Scope
Rocket PCB's PCB prototyping can be widely used in various fields.In addition to providing high-quality products, Rocket PCB also provides effective solutions based on the actual conditions and the needs of different customers.
Company Advantages
1. Rocket PCB ic wire bonding is developed and constantly improved regarding its technical and aesthetic performance, making it perfectly meet the requirements in the sanitary ware industry.
2. Reliable quality and durability are our competitive advantages.
3. The product excels in performance, durability and usability.
4. Our wire bonding technology are popular overseas.


Professional Gold wire bonding pcb bonging pad PCB fabrication-1

Common PCB plating and wire bonding methods include

  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Product application

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Consumer electronics
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Automotive electronics
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. has many production lines to meet higher demands from customers.
2. High technology is strictly adopted to ensure the quality of ic wire bonding .
3. To Rocket PCB Solution Ltd., technology innovation is a strategic engine for an enterprise’s sustainable development. Inquire! We will always providing high quality and best service for our wire bonding technology . Inquire! Making a greater contributions to the development of wire bonding pcb is our long-lasting goal. Inquire! Guaranteed innovative capabilities plays an important role in driving Rocket PCB to be a leading brand in the market. Inquire!
Rocket PCB ic wire bonding is manufactured with precision. Its manufacturing process includes conventional machining, special processing, and heat treatment.
The components or parts used in Rocket PCB ic wire bonding are required to pass relevant requirements. They will be inspected or tested for strength, hardness, durability, and other mechanical properties using different testing methods.
In the design phase of Rocket PCB ic wire bonding, many factors have been taken into considerations such as static and dynamic deformations of the structures, stability, accuracy, and anti-fatigue performance, etc.
Rocket PCB wire bonding technology is a design integrating intelligence. Automatic control and automation detection technologies that are highly efficient are adopted into its design.
The quality of Rocket PCB ic wire bonding is ensured. It has been tested to determine if its structure, mechanical parts are suitable for its intended use.
It can effectively resist stains. A kind of surface sealer has been applied to allow the surface to be not prone to accumulate some acidic liquids like vinegar, red wine, and lemon juice.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!