wholesale wire bonding services finished wire for digital device

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.

Gold wire bonding

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methods

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Common PCB plating and wire bonding methods include

◪ Aluminum Wedge Wire Bonding and ENIG Plating

◪ Gold Ball Wire Bonding and soft gold plating

◪ Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

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Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

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Rocket PCB wire bonding services undergoes a series of strict quality testings. Main tests performed during its inspection are size measurement, material & color check, static loading test, etc. The product makes the process of replacing the particular failure components easier

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Rocket PCB wire bonding services is a professional design. It is by our designer who master the design elements and principles, color theory, the basic bedding outline, as well as bedding modeling and details. All the components within this product are fixed using solder flux

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Rocket PCB wire bonding services will be inspected and tested after it is finished. Its appearance, dimension, warpage, structural strength, temperature resistance, and flame retardant ability will be tested by professional machines. The product reduces the possibility of loose connections or short circuit

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Rocket PCB wire bonding services has a very fine surface. The surface treatment is carried out in strict accordance with the highest international packaging and printing standards. It improves the wiring density and reduces the spacing of components

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Rocket PCB wire bonding services follows the principles of five fashion design principles, rhythm, unity, balance and proportion, as well as outstanding and conspicuous design. The product features low electric currents and radiation emission

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wire bonding services Selected high-quality plastic raw materials, manufactured by advanced technology and technology, have good corrosion resistance, will not be eroded by rain and snow to cause performance degradation, very suitable for coastal areas with strong salt spray corrosion and air heavily polluted areas.