packaging metal core pcb packaging circuit for wholesale

Packaging metal core pcb packaging circuit for wholesale

Name:: IC substrates

Material:: FR4

Board thickness:: 1.6mm

Surface treatment:: Immersion Gold

Technology:: Microvia Manufacturing, patterning and copper plating control, product reliability test technology

Payment:: L/C,T/T,Western Union

Certification:: UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)

Delivery Term：: DDU, FOB, CFA, CIF, CPT, EXW

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About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

packaging metal core pcb packaging circuit for wholesale-1

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

◪ CSP (Chip Scale Packages)

◪ FC-CSP (Flip Chip) CSP

◪ COB (Chip on Board)

◪ PoP (Package on Package)

◪ COB (Chip on Board)

◪ PiP (Package in Package)

◪ SiP (System in Package)

◪ RF Module

◪ LED Package

Product application

packaging metal core pcb packaging circuit for wholesale-2

Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

packaging metal core pcb packaging circuit for wholesale-8

Medical electronics

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Security Industry

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