top quality metal core pcb integrated substrate for equipment

About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

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Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

◪ CSP (Chip Scale Packages)

◪ FC-CSP (Flip Chip) CSP

◪ COB (Chip on Board)

◪ PoP (Package on Package)

◪ COB (Chip on Board)

◪ PiP (Package in Package)

◪ SiP (System in Package)

◪ RF Module

◪ LED Package

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

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The design of Rocket PCB metal core pcb is strictly conducted. It is carried out by our designers who think highly of parts and components safety, the whole machine safety, operation safety, and environmental safety. The product is perfectly suitable for the most demanding industrial applications

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The necessary tests for Rocket PCB metal core pcb have been strictly conducted. It has been tested in terms of safety, electromagnetic compatibility, vibration, reliability, and durability. It can be used for a broad variety of liquids, such as oil, water, and chemical

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The design of Rocket PCB metal core pcb involves many considerations. They may include stress points, support points, yield points, wear resistance capacity, toughness, and friction force. The product is easy to maintain and helps improve productivity

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Before delivery, Rocket PCB metal core pcb has to undergo a wide range of tests. It is strictly tested in terms of the strength of its materials, statics&dynamics performance, resistance to vibrations&fatigue, etc. This product has a compact and robust design

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The manufacture of Rocket PCB metal core pcb involves some critical processes. These stages include concept confirmation, metal materials procurement, frame fabrication, components machining, surface painting, and final assembly. It has the capability of ultimate pressure, flow output horsepower

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The product has stable operating pressure. During the operation, the pump depletion phenomenon is eliminated to avoid dry friction or damage to sealing. The product combines principles of simple operation with rugged construction