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packaging ic substrate pcb integrated circuit for equipment

Packaging ic substrate pcb integrated circuit for equipment

Name:
IC substrates
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Details
With a focus on details, Rocket PCB strives to create high-quality printed circuit board.Good materials, advanced production technology, and fine manufacturing techniques are used in the production of printed circuit board. It is of fine workmanship and good quality and is well sold in the domestic market.
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Company Advantages
1. The manufacturing processes of Rocket PCB prototype circuit board are strictly conducted. These processes include metal materials preparation, cutting, polishing, and mechanical assembly.
2. The product is highly praised for its strong usability and consistent performance.
3. The combination of prototype circuit board and metal core pcb shows the greater function of ic substrate pcb .
4. Our products have got global popularity and excellent reputation.
5. This product is widely recognized by the customers in the industry.
About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

packaging ic substrate pcb integrated circuit for equipment-1

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

  ◪   CSP (Chip Scale Packages)

  ◪   FC-CSP (Flip Chip) CSP

  ◪   COB (Chip on Board)

  ◪   PoP (Package on Package)

  ◪   COB (Chip on Board)

  ◪   PiP (Package in Package)

  ◪   SiP (System in Package)

  ◪   RF Module

  ◪   LED Package



Product application


packaging ic substrate pcb integrated circuit for equipment-2                
Consumer electronics
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Automotive electronics
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Communications
packaging ic substrate pcb integrated circuit for equipment-5                
Energy
packaging ic substrate pcb integrated circuit for equipment-6                
Industrial & Instrumentation
packaging ic substrate pcb integrated circuit for equipment-7                
IOT/Smart Home
packaging ic substrate pcb integrated circuit for equipment-8                
Medical electronics
packaging ic substrate pcb integrated circuit for equipment-9                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. has been offering quality prototype circuit board since inception. We have engaged in R&D, manufacture, and supply for years.
2. We have experienced product management professionals. They have exceptional abilities in problem analyzing and solving with regard to product development, design, and production.
3. Rocket PCB is carrying out the spirit of metal core pcb , and keep ic substrate pcb forward. Ask online! In order to satisfy users, we provide both high quality custom printed ciruit board and first-rate service. Ask online! Rocket PCB always takes responsibility for the development of pcb industry industry. Ask online! The realization of pwb board is the mission of Rocket PCB. Ask online!
Rocket PCB pcb industry is made of well-selected materials which are high quality and durable.
Rocket PCB pcb industry is manufactured under modern management system.
Rocket PCB ic substrate pcb is manufactured as per the set industry production specification using the finest quality raw materials.
Only whoever uses the best raw materials for his products can also manufacture first-class prototype circuit board.
During the process of Rocket PCB ic substrate pcb, we adopts advanced production technology.
Rocket PCB Solution Ltd. Standardized production mode is adopted to standardize every step in the production process, so as to achieve the purpose of comprehensively improving the resource utilization rate, reduce the loss of materials in the production process to the greatest extent, optimize the production cost, and thus ensure the [ 10219] On the premise of the same quality and performance, the added value is high and the price is better. Compared with similar products, the cost performance is high, and the purchase of our products can save more costs.
Product Message
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