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multi-layer printed circuit board manufacturing board fabrication

Multi-layer printed circuit board manufacturing board fabrication

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
E-mail:
Product Advantage
  • Rocket PCB pays great attention to product quality and strives for perfection in every detail of products. This enables us to create fine products.
  • Rocket PCB Solution Ltd. is a modern company engaged in the production, processing, service and distribution of printed circuit board.
  • Rocket PCB has R&D talents with great technical capabilities and management talents with rich experience. Our company is able to develop sustainably thanks to them.

FEATURES OF BACKLANE


The backplane has a lot of distinctive features.
Size

A large part of the backplane is connected to some of the other boards at right angles. This requires that the backplane be much larger than conventional PCBs and that some backplanes even reach the 762mmx1066.8mm

The number of layers

In terms of the most common backplane, its layer is already in the 16~28, this number is much higher than the ordinary PCB

Thickness

From the structure of the backplane itself, in order to be able to withstand more mechanical stress, it has to be designed much thicker than ordinary PCB. In most cases, the designer has to increase its thickness, and the typical backplane thickness is 2mm-4mm, which can be as thick as 4mm-6mm.


With the continuous development of science and technology, users of bandwidth requirements are becoming more and more stringent, which requires that the design of the backplane to be precise and rigorous enough, the production process of ordinary PCB has been far from meeting the needs of modern production. In order to produce a backplane that meets a variety of conditions, it is necessary to eliminate some of the original conventional equipment and replace it with a hybrid bus structure and assembly technology.




Product CASE

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High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise

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Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Adherence to design principle of printed circuit board manufacturing makes possible the use of printed circuit board manufacturing more printed circuit board manufacturing. The product is anti-static and anti-magnetic field
We update printed circuit board manufacturing with modern technology frequently, making it printed circuit board manufacturing. It reduces the power waste and is of energy-saving performance
Materials of printed circuit board manufacturing is actually quite printed circuit board manufacturing. Superior insulation performance makes the product stand out among the industry
printed circuit board manufacturing takes the advantages of printed circuit board manufacturing. It can still work perfectly even under severe weather
printed circuit board manufacturing is designed to be printed circuit board manufacturing across the market. It has helped the company win the Utility Model Patent Certificate and Design Patent Certificate
The product features user-friendliness. Every detail of this product is designed aiming to offer maximum support and convenience. It can store the latest 1000pcs unlocking records
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