loading
Rocket PCB  >  AI - Page Sitemap  >  multi-layer printed circuit board manufacturing board fabrication
multi-layer printed circuit board manufacturing board fabrication

Multi-layer printed circuit board manufacturing board fabrication

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Advantage
  • Rocket PCB pays great attention to product quality and strives for perfection in every detail of products. This enables us to create fine products.
  • Rocket PCB Solution Ltd. is a modern company engaged in the production, processing, service and distribution of printed circuit board.
  • Rocket PCB has R&D talents with great technical capabilities and management talents with rich experience. Our company is able to develop sustainably thanks to them.

FEATURES OF BACKLANE


The backplane has a lot of distinctive features.
Size

A large part of the backplane is connected to some of the other boards at right angles. This requires that the backplane be much larger than conventional PCBs and that some backplanes even reach the 762mmx1066.8mm

The number of layers

In terms of the most common backplane, its layer is already in the 16~28, this number is much higher than the ordinary PCB

Thickness

From the structure of the backplane itself, in order to be able to withstand more mechanical stress, it has to be designed much thicker than ordinary PCB. In most cases, the designer has to increase its thickness, and the typical backplane thickness is 2mm-4mm, which can be as thick as 4mm-6mm.


With the continuous development of science and technology, users of bandwidth requirements are becoming more and more stringent, which requires that the design of the backplane to be precise and rigorous enough, the production process of ordinary PCB has been far from meeting the needs of modern production. In order to produce a backplane that meets a variety of conditions, it is necessary to eliminate some of the original conventional equipment and replace it with a hybrid bus structure and assembly technology.




Product CASE

multi-layer printed circuit board manufacturing board fabrication-1

High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise

multi-layer printed circuit board manufacturing board fabrication-2


Product application


multi-layer printed circuit board manufacturing board fabrication-3                
Consumer electronics
multi-layer printed circuit board manufacturing board fabrication-4                
Automotive electronics
multi-layer printed circuit board manufacturing board fabrication-5                
Communications
multi-layer printed circuit board manufacturing board fabrication-6                
Energy
multi-layer printed circuit board manufacturing board fabrication-7                
Industrial & Instrumentation
multi-layer printed circuit board manufacturing board fabrication-8                
IOT/Smart Home
multi-layer printed circuit board manufacturing board fabrication-9                
Medical electronics
multi-layer printed circuit board manufacturing board fabrication-10                
Security Industry

Throughout the manufacturing process of Rocket PCB printed circuit board manufacturing, tight tolerances and strict process controls are essential to ensure that there is no contamination, physical damage on the electrodes. The product provides protection against light, heat, and oxygen
Rocket PCB printed circuit board manufacturing is developed adopting the philosophy of ergonomics by the in-house R&D department. Each part of the product is designed with different functions for the foot. Its rolling end face is very smooth and neat
In the researching and developing stage of Rocket PCB printed circuit board manufacturing, the R&D has integrated different water purification techniques which meet the domestic pure water standard. Containing no harmful glue, it is safe to use
Rocket PCB printed circuit board manufacturing has gone through a series of quality tests to meet the desired reliability, life-cycle costs, and the speed standards for the mechanical seal application. The product does not peel off even used in a humid environment
Rocket PCB printed circuit board manufacturing is professionally designed. It is carried out by our designers who know about jewelry ring and setting basics and understand the essentials of jewelry design. Its rolling end face is very smooth and neat
The product is not prone to electromagnetic influence. It has passed the electromagnetic compatibility(EMC) test and is able to withstand extreme weather conditions such as thunderstrike. It has good temperature resistance performance
Product Message
Chat Online
Chat Online
Leave Your Message inputting...
Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@sllpcb.com, and we will reply to you ASAP. Welcome, what can I help you?
Sign in with: