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multi-layer pcb technologies board Rocket PCB

Multi-layer pcb technologies board Rocket PCB

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Comparison
Rocket PCB carries out strict quality monitoring and cost control on each production link of printed circuit board, from raw material purchase, production and processing and finished product delivery to packaging and transportation. This effectively ensures the product has better quality and more favorable price than other products in the industry.Compared with other products in the same category, printed circuit board produced by Rocket PCB has the following advantages.
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Company Advantages
1. The manufacturing process of Rocket PCB pcb order involves the following basic steps: rubber material selection, molding, cutting, vulcanizing and deflashing.
2. Due to the implementation of a complete quality management system, the product meets the most stringent quality standards.
3. Superb as quality of pcb technologies is, Rocket PCB Solution Ltd. also builds a quality control system.
4. With years of producing pcb technologies, Rocket PCB has its own technology to develop new products.

Capabilities involved in PCB backplane design


CCL

Because the thickness of the backplane, size and is not the same as a conventional board, its performance requirements for the CCL is not the same

Thickness

The thickness of the backplane is thicker than that of the conventional board

Size

The size of the backplane is much larger, for production also has this certain impact

Drilling

Due to the increase in thickness and the use of crimp contact, the accuracy of drilling and the ability to copper plating has special requirements

The number of layers

The layer of the backplane also be developed to the high-level number, more than 10 layers of design is also more common.

Layout

Backplane wiring density is relatively small, but there are special requirements for impedance requirements and inner-layer lines.

Surface treatment

Due to the thickness of the backplane, size is relatively large, some surface treatment process is more difficult to achieve

Special process

Due to the characteristics of the backplane itself, the backplane sometimes uses some special processes.



OUR STRENGTHS
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In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger



CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing


FEATURES



  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias









Advanced Product and Technology
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multi-layer pcb technologies board Rocket PCB-1




Product Feature
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multi-layer pcb technologies board Rocket PCB-2

High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise

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Our Services
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  • 24 hour real-time technical support Quick turn around with 24 hours and instant quote. For Backplane board, will be based on board parameters, normally 15-30 days.

  • Effective and flexible PCB engineering solutions save your cost. We always put the best interests first when providing innovative solutions for manufacturing customers’ products, we are more willing to help customers grow.

  •   Rapid feedback on the layout,build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates, etc.

  •   Strong partnerships with different reputed material suppliers such as Rogers, Arlon, Nelco and Taconic can realize a fast service to a wide range of PCB applications.

  •   Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc.100% outgoing pass rate.

  •   Complete services from free DFM, traceable manufacturing to complete after-sales service, on time delivery 99%.

  •   We will keep secret for customer sale area, design ideas, drawing and all other private information.

  •   Flexible payment terms. Samples for 100%TT, mass production payment: 50% advance payment 50% balance should be paid off before loading or accept monthly statement if the order is stable.




Product Application
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Consumer electronics
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Automotive electronics
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Communications
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Energy
multi-layer pcb technologies board Rocket PCB-8                
Industrial & Instrumentation
multi-layer pcb technologies board Rocket PCB-9                
IOT/Smart Home
multi-layer pcb technologies board Rocket PCB-10                
Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a leading global provider of pcb technologies.
2. High-tech talents in Backplane PCB field are hired by Rocket PCB Solution Ltd..
3. Rocket PCB Solution Ltd. makes a endeavor to bring better high speed backplane and better service to customers. Contact! Rocket PCB Solution Ltd. strives to create brands with market appeal and market competitiveness! Contact! Rocket PCB Solution Ltd. aims to create an world-known brand in future. Contact! Rocket PCB Solution Ltd.'s quality policy: Always stand in the customer's position and produce pcb technologies products that satisfy customers. Contact!
Rocket PCB pcb technologies has encompassed various elements in its design. The elements of foot biomechanics, physical stress, weight points & balance, and the distribution of load have been considered. The product has high sensitivity to quickly respond to users' operation
Rocket PCB pcb order is produced strictly according to the standards in furniture manufacturing. The product has been tested officially and passed the domestic certifications of CQC, CTC, QB. The product can largely reduce waste materials
The production of Rocket PCB Backplane PCB includes the basic steps. These manufacturing steps include shape design by CAD, materials cutting, stamping, assembly, and physical tests. The product can largely reduce waste materials
The design of Rocket PCB pcb technologies is human orientation. People's cooking or other kitchen work's habits are taken into consideration by the designers so as to the product maximize its value. The product can withstand high-temperature working
Strict quality inspection for Rocket PCB pcb technologies will be carried out. The product will be checked for cracking of the stitching, the security of the accessories if any, seaming strength, and durability. The product can largely reduce waste materials
We have adopted a strict inspection system to control the quality when producing this product. The product has high sensitivity to quickly respond to users' operation
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!