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multi-layer high speed backplane multi-layer quality

multi-layer high speed backplane multi-layer quality

Multi-layer high speed backplane multi-layer quality

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:

Capabilities involved in PCB backplane design


CCL

Because the thickness of the backplane, size and is not the same as a conventional board, its performance requirements for the CCL is not the same

Thickness

The thickness of the backplane is thicker than that of the conventional board

Size

The size of the backplane is much larger, for production also has this certain impact

Drilling

Due to the increase in thickness and the use of crimp contact, the accuracy of drilling and the ability to copper plating has special requirements

The number of layers

The layer of the backplane also be developed to the high-level number, more than 10 layers of design is also more common.

Layout

Backplane wiring density is relatively small, but there are special requirements for impedance requirements and inner-layer lines.

Surface treatment

Due to the thickness of the backplane, size is relatively large, some surface treatment process is more difficult to achieve

Special process

Due to the characteristics of the backplane itself, the backplane sometimes uses some special processes.



OUR STRENGTHS
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In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger



CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing


FEATURES



  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias









Advanced Product and Technology
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multi-layer high speed backplane multi-layer quality-1




Product Feature
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multi-layer high speed backplane multi-layer quality-2

High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise

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Our Services
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  • 24 hour real-time technical support Quick turn around with 24 hours and instant quote. For Backplane board, will be based on board parameters, normally 15-30 days.

  • Effective and flexible PCB engineering solutions save your cost. We always put the best interests first when providing innovative solutions for manufacturing customers’ products, we are more willing to help customers grow.

  •   Rapid feedback on the layout,build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates, etc.

  •   Strong partnerships with different reputed material suppliers such as Rogers, Arlon, Nelco and Taconic can realize a fast service to a wide range of PCB applications.

  •   Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc.100% outgoing pass rate.

  •   Complete services from free DFM, traceable manufacturing to complete after-sales service, on time delivery 99%.

  •   We will keep secret for customer sale area, design ideas, drawing and all other private information.

  •   Flexible payment terms. Samples for 100%TT, mass production payment: 50% advance payment 50% balance should be paid off before loading or accept monthly statement if the order is stable.




Product Application
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multi-layer high speed backplane multi-layer quality-4                
Consumer electronics
multi-layer high speed backplane multi-layer quality-5                
Automotive electronics
multi-layer high speed backplane multi-layer quality-6                
Communications
multi-layer high speed backplane multi-layer quality-7                
Energy
multi-layer high speed backplane multi-layer quality-8                
Industrial & Instrumentation
multi-layer high speed backplane multi-layer quality-9                
IOT/Smart Home
multi-layer high speed backplane multi-layer quality-10                
Medical electronics
multi-layer high speed backplane multi-layer quality-11                
Security Industry

Materials selection for Rocket PCB high speed backplane will go through serious inspection. Factors including the safety of ingredients, materials' physical advantages, moisture absorption, and bacterial resistance will be taken into consideration. With finest base, all Hoone products enjoy longer service time
Rocket PCB high speed backplane is inspected in various aspects. The pattern correction is checked based on size set garments measurement, the cut panels inspected before inputting to the sewing section, and fabric bonding strength checked after fusing. Hoone can customize products to satisfy the needs of customers
The design of Rocket PCB high speed backplane is carried out based on physical ergonomics. It considers pelma adjustment, arch mechanics, symmetrical stress on feet, etc. The quality of raw materials can be greatly guaranteed
Rocket PCB high speed backplane is required to pass the necessary workmanship assessments. It has to be assessed in terms of flexibility, stress distribution, slip resistance, and feet ergonomics. There are different styles of handles for you to choose, including American style, European style, etc
The design factors of Rocket PCB high speed backplane are well-considered. It is carried out by our designers who concern about safety as well as the users’ convenience for manipulating, and convenience for maintenance. New mold according to your drawings or sample can be offered
Our QC team implements strict quality control to ensure the high quality of this product.
The product is rigorously examined under the supervision of skilled quality experts. There are over 10000 items for customers to choose
We have adopted a strict inspection system to control the quality when producing this product. The quality of raw materials can be greatly guaranteed
It has exemplary quality as it is produced with testing equipment and production technology. .
Our dedicated QC team is responsible for the final quality testing result. Processed by zinc alloy materials, high quality of Hoone products can be well guaranteed
Compared with other products, the product has more obvious advantages of longer service life and more stable performance which have been tested by authoritative third parties. Good shape retention is one of the advantageous features of Hoone products
Rocket PCB Solution Ltd. has a professional R&D group and highly qualified staff members. Processed by zinc alloy materials, high quality of Hoone products can be well guaranteed
Rocket PCB has established long-term and stable cooperation with many competitive brands. Processed by zinc alloy materials, high quality of Hoone products can be well guaranteed
Rocket PCB Solution Ltd. is committed to providing outstanding technical services to our clients. Processed by zinc alloy materials, high quality of Hoone products can be well guaranteed
The production testing procedure for high speed backplane is rigorous. Hoone handles are wear-resistant and refined
Mass production of high speed backplane with high quality is available in Rocket PCB. All products of Hoone are environmental-friendly and healthy
Since the establishment, Rocket PCB Solution Ltd. has relied on the development vision of high speed backplane. Processed by fine polishing technique, Hoone products are exquisite in its quality
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!