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multi-layer double layer pcb at discount bulk production

Multi-layer double layer pcb at discount bulk production

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Company Advantages
1. The design idea of Rocket PCB keeps up with the modern aesthetic trend. Its connections made automatically through copper tracks
2. According to the requirements of quality management system, each double layer pcb has been tested strictly before package. The product allows a high density among components
3. The product is safe and harmless. It has been tested to ensure no free formaldehyde, heavy metals, and aromatic amine are residual in its materials. It plays an important role in modern electronic equipment


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. We have lean and flexible management layers. They are able to drive quick and effective decision making and thus enable the company to bring high-quality products quickly to market.
2. We strive for energy-efficient production. There are many innovative technologies that have been selected to minimize or eliminate emissions.
Rocket PCB double layer pcb must go through a large number of manufacturing steps which mainly include shoe pattern design, cutting, stitching, and assembling. The product is not likely to peel off
The manufacturing process of Rocket PCB double layer pcb involves coagulating the field latex with acid and passing the coagulated latex through cutting machines and a series of creping rollers. The product is not likely to peel off
Practical design: Rocket PCB double layer pcb is designed to provide a useful way for users to write and sign. With its small, compact design, it is for easy transport and efficient use of counter space. The product has high strength and resilience
Rocket PCB double layer pcb is constantly monitored. It is inspected by our trained staff who works exclusively to ensure the correct execution and dimensional control of the product that they are following. The product is very thin and sensitive so can be used to transfer extremely small and detailed images and logos
In the production of Rocket PCB double layer pcb, the heat sealing machine is applied to guarantee the splicing bounding areas are finely sealed. This procedure is scrutinized by skilled workers. The product helps guarantee first-class printing quality
The product has great softness. Its fabric is chemically treated by changing the fiber and the surface performance to achieve the soft effect. The product is extensively used in printing images for digital image-making, daily necessities, and automotive (motorcycle) supplies industries
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!