multi-layer any-layer pcb at discount precision for wholesale

Latest products

Wire Bonding pcb ENEPIG surface finished high quality PCB production

Wire bonding ENEPIG PCB bonding PCB gold wire bonding

High density HDI PCB 4+N+4 HDI PCB board manufacturing

Double Sided PCB prototyping FR4 2-layer PCB fast turn

Product Information
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Enterprise Strength

Rocket PCB has a professional customer service team to provide quality and considerate services for customers.

Company Advantages
1. any-layer pcb ensures the high precision of products.
2. The product is anti-bacterial. The antimicrobial agent is added to improve the cleanliness of the surface, preventing the growth of bacteria.
3. Rocket PCB Solution Ltd.'s production department can complete work order timely and achieve high quality standard.
4. Rocket PCB Solution Ltd. applys the advanced technology so flexibly that it can guarantee both quality and quantity while finishing the production tasks.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

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◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

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EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

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FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

Company Features
1. The Rocket PCB brand is spoken highly of by customers in the industry.
2. Rocket PCB Solution Ltd. upgrades itself through the extensive deployment of advanced technologies and applications.
3. Rocket PCB Solution Ltd. is committed to becoming a sustainable company in any-layer pcb field. Ask online! Rocket PCB Solution Ltd. provide decent production scheme with dual layer pcb . Ask online! Rocket PCB upholds the concept of HDI PCB fabrication. Ask online! Rocket PCB Solution Ltd. highly values the importance of enterprise culture. Ask online!

r******w

The design of Rocket PCB dual layer pcb follow these basic steps: recognition of its need or purpose, selection of a possible mechanism, analysis of forces, material selection, design of elements (sizes and stresses), detailed drawing, etc.

s******g

Advanced machining techniques have been adopted in Rocket PCB HDI PCB fabrication production. It is fabricated under CNC machining, electrical discharge machining (EDM), laser cutting, and other treatments. GJ Bush is top rubber bushing manufacturer since 1998, focusing on auto parts engine mounting and suspension bushings for more than 22 years

m******l

Materials used for Rocket PCB HDI PCB fabrication has been tested. The tests include toughness or brittleness testing, hardness testing, tensile testing, etc. GJ Bush is top rubber bushing manufacturer since 1998, focusing on auto parts engine mounting and suspension bushings for more than 22 years

n******f

Rocket PCB dual layer pcb must be inspected in many aspects. They are harmful substances content, lead content, dimensional stability, static loading, colors, and texture.

y******y

Rocket PCB any-layer pcb has a very scientific design. Humidity, temperature, carbon dioxide and light, as well as other factors such as rain, airflow or noise, are environmental concerns in design. Our main products are rubber bushing, suspension bushings, engine mounting, strut mounting, etc

q******r

The product is highly resistant to pressure. It is made of composite metal materials such as copper or aluminum alloy which feature excellent hardness and anti-impact resistance. GJ Bush is top rubber bushing manufacturer since 1998, focusing on auto parts engine mounting and suspension bushings for more than 22 years

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Multi-layer any-layer pcb at discount precision for wholesale

Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application