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at discount pcb manufacturing process at discount Rocket PCB

At discount pcb manufacturing process at discount Rocket PCB

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
E-mail:
Product Details
With the pursuit of excellence, Rocket PCB is committed to showing you unique craftsmanship in details.PCB prototyping, manufactured based on high-quality materials and advanced technology, has excellent quality and favorable price. It is a trustworthy product which receives recognition and support in the market.
  • at discount pcb manufacturing process at discount Rocket PCB-Rocket PCB-img-1
Enterprise Strength
  • Rocket PCB carries out clear management on after-sales service based on the application of the online information service platform. This enables us to improve efficiency and quality and every customer can enjoy excellent after-sales services.
Company Advantages
1. In the design of Rocket PCB HDI PCB fabrication, our experienced designers utilize the concepts of clean lines that don't make the bathroom look cluttered.
2. pcb manufacturing process is HDI PCB fabrication, it provides a new method to dual layer pcb .
3. pcb manufacturing process is widely polulor around the world.
4. This product is strikingly strong. It is less likely to tear because of bad weather, rough handling, or inadvertent mistakes.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





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EXTENSIVE ANALYTICAL TESTINGat discount pcb manufacturing process at discount Rocket PCB-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB hires those who has been experienced and technical in pcb manufacturing process industry for years.
2. By developing new technological methods, Rocket PCB manufactures any-layer pcb to be a more competitive product.
3. Due to the positive basic principles, Rocket PCB aims to be an efficient HDI PCB fabrication manufacturer. Ask! Rocket PCB Solution Ltd. has always been focused on the professional production of double layer pcb . Ask!
During the production of Rocket PCB pcb manufacturing process, it is strictly tested, including lifetime test, heat and power breakdown test, and mechanical damage test. It has alert functions for fault diagnosis
Rocket PCB [any-layer pcb is of high performance. It has undergone professional and strict spectral and photoelectric analysis to has high luminous efficiency. It can be designed with mechanical keyboards with luminous LED light
During the production of Rocket PCB any-layer pcb, The overall light quality such as color rendering, color temperature, and the efficiency of the light source is obviously enhanced. It has high resistance from breakage and flame
Rocket PCB HDI PCB fabrication is certified. It not only meets the requirements of GB and IEC standards but meets the UL safety certification. It has high resistance from breakage and flame
Rocket PCB double layer pcb is well manufactured. Every process such as chip producing, bulb manufacturing, and lampshade surface treatment are paid close attention. It offers effective protection for merchandise against weather conditions
The product has high tensile strength. It has been assessed under a pull test to check its tensile force when filled with a certain level of pressure. It offers effective protection for merchandise against weather conditions
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!