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Product Details

With the pursuit of excellence, Rocket PCB is committed to showing you unique craftsmanship in details.PCB prototyping, manufactured based on high-quality materials and advanced technology, has excellent quality and favorable price. It is a trustworthy product which receives recognition and support in the market.

Enterprise Strength

Rocket PCB carries out clear management on after-sales service based on the application of the online information service platform. This enables us to improve efficiency and quality and every customer can enjoy excellent after-sales services.

Company Advantages
1. In the design of Rocket PCB HDI PCB fabrication, our experienced designers utilize the concepts of clean lines that don't make the bathroom look cluttered.
2. pcb manufacturing process is HDI PCB fabrication, it provides a new method to dual layer pcb .
3. pcb manufacturing process is widely polulor around the world.
4. This product is strikingly strong. It is less likely to tear because of bad weather, rough handling, or inadvertent mistakes.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......

ROCKET PCB Any Layer PCB （ELIC）process flow

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Anylayer PCB DFM suggestion for layout

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Product FEATURES

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◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

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CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

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EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

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FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

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Consumer electronics

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Automotive electronics

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Communications

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Energy

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Industrial & Instrumentation

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IOT/Smart Home

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Medical electronics

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Security Industry

Company Features
1. Rocket PCB hires those who has been experienced and technical in pcb manufacturing process industry for years.
2. By developing new technological methods, Rocket PCB manufactures any-layer pcb to be a more competitive product.
3. Due to the positive basic principles, Rocket PCB aims to be an efficient HDI PCB fabrication manufacturer. Ask! Rocket PCB Solution Ltd. has always been focused on the professional production of double layer pcb . Ask!

s******m

Thanks to the low cost of raw materials and the high efficiency of streamlined production, HDI PCB fabrication products have the advantage of high gross profit margin. Its signal paths are well organized and exposed quite well

l******x

Rocket PCB any-layer pcb comes in a variety of wonderful designs. Its assembly process is conducted by a computer, leaving very little room for error

e******w

High technical assurance and first-class quality can be seen on any-layer pcb. The product makes the process of replacing the particular failure components easier

a******h

All raw materials used to manufactured Rocket PCB any-layer pcb have to go through stringent quality checking procedure. The electronic components and their polarities on it are clearly labeled

w******o

The design of Rocket PCB HDI PCB fabrication focuses on the technique and function.

f******g

HDI PCB fabrication has advantages both in cost, reliability and long life, in comparison with other similar products. Its simple design makes it easier for users to maintain and manipulate

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Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application