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About our product
Rocket PCB uses the industry's excellent Bergquist materials, with high thermal conductivity insulation layer, to ensure the lowest operating temperature, brightest brightness and longest service life of LED. In fact, aluminium substrates with high thermal conductivity can be used in any LED application area.
However, most of the insulating layers of aluminium substrates on the market are made of commercialized FR-4 semi-cured sheets. These insulating layers are all made of epoxy resin. Although these insulating layers have good bonding properties, they have high thermal resistance (thermal conductivity is only the 0.3w/m·k) because they are not filled with high thermal conductivity and high insulation ceramic fillers.
If the aluminum substrate is used, the heat generated by the high power density module can hardly be transmitted to the metal substrate, so the thermal accumulation will accelerate the aging of the power module and eventually lead to the failure of the module. And the insulation strength of this kind of aluminium substrates is limited (<2ΣKVAC), it is difficult to meet the requirements of security testing, and can only be used in low power density situations. For high power density modules, it is difficult to be competent, and there are great hidden dangers.
Bergquist conducts 12 to 18 months of certification tests before each product is put on the market. Bergquist' comprehensive quality verification includes mechanical performance, bonding strength, electrical insulation performance and thermal conductivity performance tests. In order to verify the reliability of long-term use, a test cycle of 2000 hours is usually selected. The main results are as follows:
500 cycles lasting 350 hours in the range of 40℃~150℃
2000 hours thermal aging test at 175 ℃
1 minute at 300 ℃ and 72 hours thermal shock test at 200 ℃
It is these rigorous validation tests that ensure the supremacy of the bergquist thermal Clad in the industry.
There are also the following unique advantages,
Compliance with RoHs requirements
In the design of electric circuit, thermal diffusion can be treated effectively.
Reducing the operating temperature of the module, prolonging the service life, increasing the power density and reliability
Reduce the assembly of radiator and other hardware (including thermal interface materials), reduce module size, and reduce hardware and assembly costs;
Replacing fragile ceramic substrates for better mechanical durability
VS
> Our factories have invested heavily in importing advanced production facilities from abroad. Such as Burkle laminator, Mitsubishi laser drill, Hitachi mechanical drill, Japan screen automatic exposure machine, LDI, AOI etc, highly automated manufacturing. With a monthly output of up to 250,000 square meters.
> Our suppliers have formed a complete production process, become more professional, modern and large-scale, and signed long-term strategic cooperation agreements with well-known enterprises at home and abroad.
> Under the system of ISO 9001, ISO 14001, ISO/TS16949, OHSAS 18001, ISO/IEC27001, UL, SGS and RoHS, we have guaranteed our excellent quality and leading market position with strong technical development momentum. We also adhere to the 5S method, lean and Six Sigma quality system.
> We provide real-time and in-depth technical support and tailor-made application solutions, such as high speed, large capacity, high frequency, mixed pressure (hybrid structure), heat dissipation metal base solutions.
> Free DRC and DFM. Elite engineers with years of experience provide you with free and comprehensive engineering review and support.
> Rapid feedback on the layout, build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates and other engineering questions. When providing innovative solutions for our customers'products, we always consider maximizing the benefits for our customers.
> Rocket provides industry-leading support to our customers,we are more willing to help customers grow.
Advanced Product and Advanced Technology
> Quotation for standard projects within 2 hours, quick 24 hours PCB prototype making.
> Multiple different product lines meet the requests of fast delivery of small batches and multi-variety prototyping and mass production.
> Expedited production line for prototyping double-sided PCB up to 24 hours, 4 layers 48 hours, 6 layers 72 hours etc.
> Mass production of double-sided PCB 5-6 days lead time, multi-layer PCB 7-9 days for standard boards.
> DHL, FedEx, TNT, UPS Express, fully meet the customer's rapid turnover requirements, punctual delivery rate of more than 99%.
> Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc. 100% outgoing pass rate.
>
Provide 1-64 layers of different thickness, different materials,
different processes of product customization, of which the CCL using
A-class raw materials, high quality assurance.
> Unlimited PCB capabilities,we provide various and advanced technology PCBs include rigid, FPC, rigid-flex, metal core, microwave/RF, HDI, any layer, heavy copper, large-size, embedded, LED, backplane, ceramic substrate, IC substrate, high-frequency, high-density and high-performance PCB.
> Eight major surface treatment technology and high-quality ink printing, beautiful and reliable.
R&D is a key factor in developing new
competitive advantage in the electronic manufacturing industry. Rocket
PCB Solution Ltd in particular has devoted to R&D and as a result,
we constantly soar ahead of competition. We have continued to absorb the
talents from all directions to constitute the strong R&D team.
An innovative and creative R&D team is a key competitive advantage
for Rocket PCB. Without this team, we could not have become a
competitive manufacturer in the electronic manufacturing industry. The
team focuses on midterm proactive development and long-term research,
which includes quality improvement, operational efficiency, analysis of
every stage of production, and new and existing PCB solutions. In order
to maintain and improve R&D strength, our R&D team regularly
participate in high-level seminar in the electronic manufacturing
industry, keep close to the industry dynamics and frequently update
their industry expertise. The long-standing commitment to R&D has
brought our business results to the highest level.
To show our
improving R&D capability in the market, we successfully developed
Aluminum PCB. The distinctive characters are High quality and
quick turn.
Rocket PCB is established as a provider of aluminum PCB with tailored service at affordable price. Aiming to
become an international high-quality supplier in the electronic
manufacturing industry, we will carry forward the outstanding spirit of
'Focus on customer first' and keep making progress in technology
innovation, constantly challenge ourselves and provide better and better
services for customers. Contact us today at https://www.rocket-pcb.com to learn more about what we can offer to your business.
SPECIALIZED MANUFACTURING
Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro
CAPABILITIES
3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias
Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing
FEATURES
PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias
Security Industry
QUICK LINKS
CONTACT US
Office: (+86) 755 23040566
Tel: (+86) 158 9965 5195
E-mail: sales@rocket-pcb.com
Skype: Hans@Rocket-PCB
Whatsapp: 86 1589965 5195
Office Address: 301 Building/B, Huafeng Digital Technology Industrial Park, Chaoyang Ro, Yanchuan, Songgang,518105 Shenzhen, China.
Plant ADD.: No 69, Lianfeng North Road, Xianxi Area, ChangAn Town, Dongguan, China.
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