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About our product
More and more demands of high density, multi-function and miniaturization bring new challenges to packaging and substrate. Many new packaging technologies emerge as the times require, including embedded packaging technology. Embedded packaging technology is to embed passive components such as resistors, capacitors, inductors and even active components such as IC into PCB. This method can shorten the circuit length between components, improve the electrical characteristics, and also improve the effective PCB packaging area, reduce a large number of welding points on PCB board surface, thereby improving the reliability of packaging. It is an ideal high density packaging technology with low cost.
But at the same time the trend of packaging substrates is thin and miniaturized, requiring finer line spacing and smaller aperture, which presents a higher challenge for material selection, surface coating technology and fine trace making, fine soldermask making and other processes.
Rocket PCB can provide high density printed circuit board products with embedded passive components (thin core thickness less than 100 micron, embedded capacitance, resistance, inductance characteristics or integration of various embedded features). It mainly provides supporting services for high-end products such as communications, medical, consumer, military/aerospace and other high-end products.
> Our factories have invested heavily in importing advanced production facilities from abroad. Such as Burkle laminator, Mitsubishi laser drill, Hitachi mechanical drill, Japan screen automatic exposure machine, LDI, AOI etc, highly automated manufacturing. With a monthly output of up to 250,000 square meters.
> Our suppliers have formed a complete production process, become more professional, modern and large-scale, and signed long-term strategic cooperation agreements with well-known enterprises at home and abroad.
> Under the system of ISO 9001, ISO 14001, ISO/TS16949, OHSAS 18001, ISO/IEC27001, UL, SGS and RoHS, we have guaranteed our excellent quality and leading market position with strong technical development momentum. We also adhere to the 5S method, lean and Six Sigma quality system.
> We provide real-time and in-depth technical support and tailor-made application solutions, such as high speed, large capacity, high frequency, mixed pressure (hybrid structure), heat dissipation metal base solutions.
> Free DRC and DFM. Elite engineers with years of experience provide you with free and comprehensive engineering review and support.
> Rapid feedback on the layout, build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates and other engineering questions. When providing innovative solutions for our customers'products, we always consider maximizing the benefits for our customers.
> Rocket provides industry-leading support to our customers,we are more willing to help customers grow.
Advanced Product and Advanced Technology
> Quotation for standard projects within 2 hours, quick 24 hours PCB prototype making.
> Multiple different product lines meet the requests of fast delivery of small batches and multi-variety prototyping and mass production.
> Expedited production line for prototyping double-sided PCB up to 24 hours, 4 layers 48 hours, 6 layers 72 hours etc.
> Mass production of double-sided PCB 5-6 days lead time, multi-layer PCB 7-9 days for standard boards.
> DHL, FedEx, TNT, UPS Express, fully meet the customer's rapid turnover requirements, punctual delivery rate of more than 99%.
> Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc. 100% outgoing pass rate.
>
Provide 1-64 layers of different thickness, different materials,
different processes of product customization, of which the CCL using
A-class raw materials, high quality assurance.
> Unlimited PCB capabilities,we provide various and advanced technology PCBs include rigid, FPC, rigid-flex, metal core, microwave/RF, HDI, any layer, heavy copper, large-size, embedded, LED, backplane, ceramic substrate, IC substrate, high-frequency, high-density and high-performance PCB.
> Eight major surface treatment technology and high-quality ink printing, beautiful and reliable.
R&D is a key factor in developing new
competitive advantage in the electronic manufacturing industry. Rocket
PCB Solution Ltd in particular has devoted to R&D and as a result,
we constantly soar ahead of competition. We have continued to absorb the
talents from all directions to constitute the strong R&D team.
An innovative and creative R&D team is a key competitive advantage
for Rocket PCB. Without this team, we could not have become a
competitive manufacturer in the electronic manufacturing industry. The
team focuses on midterm proactive development and long-term research,
which includes quality improvement, operational efficiency, analysis of
every stage of production, and new and existing PCB solutions. In order
to maintain and improve R&D strength, our R&D team regularly
participate in high-level seminar in the electronic manufacturing
industry, keep close to the industry dynamics and frequently update
their industry expertise. The long-standing commitment to R&D has
brought our business results to the highest level.
To show our
improving R&D capability in the market, we successfully developed Embedded components PCB. The distinctive characters are High quality and
quick turn.
Rocket PCB is established as a provider of aluminum PCB with tailored service at affordable price. Aiming to
become an international high-quality supplier in the electronic
manufacturing industry, we will carry forward the outstanding spirit of
'Focus on customer first' and keep making progress in technology
innovation, constantly challenge ourselves and provide better and better
services for customers. Contact us today at https://www.rocket-pcb.com to learn more about what we can offer to your business.
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QUICK LINKS
CONTACT US
Office: (+86) 755 23040566
Tel: (+86) 158 9965 5195
E-mail: sales@rocket-pcb.com
Skype: Hans@Rocket-PCB
Whatsapp: 86 1589965 5195
Office Address: 301 Building/B, Huafeng Digital Technology Industrial Park, Chaoyang Ro, Yanchuan, Songgang,518105 Shenzhen, China.
Plant ADD.: No 69, Lianfeng North Road, Xianxi Area, ChangAn Town, Dongguan, China.
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