Advanced technology embedded pcb embedded cable for wholesale

Company Advantages
1. The steel construction of Rocket PCB is designed and engineered by our in-house professional engineers. The production of this steel- hot dipped galvanized- is also undertaken in-house by our experienced team. Its compact design takes less space in a piece of application equipment
2. With an increase of application range, this product is widely accepted in the industry. All the components within this product are fixed using solder flux
3. The product has the guarantee of our know-how and internationally-certified quality. The product is widely applied in consumer electronics
4. It gives trouble free performance to the user as they are stringently tested on different quality parameters. It offers a simple platform to arrange the electronic components in a compressed way
5. It has gone through a number of quality checks before shipping. The electronic components and their polarities on it are clearly labeled

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Passive and active chips can be embedded in PCB using two basic processes: face-down and face-down. The two variants differ in the way components are connected to the outside world and use different materials and processes. Figure 1 outlines these two approaches.

In the front process, the component is placed on the carrier material, and the contact pad of the component can be seen after assembly. This method provides some very good thermal performance and is very suitable for power module embedding. Processing constraints are encountered when trying to embed components with variable thickness. After embedding, the dielectric thickness between the component surface and the external copper surface remains unchanged, which poses a challenge to the subsequent micro-laser drilling and copper plating technology, especially in the case of via filling.

In the face-down process, the component and the component image are assembled together into the carrier material. Normally, screen-printed non-conductive adhesives are used as carriers for fixing components. This method has several advantages: good thickness control of dielectric materials between components and carriers, and good registration accuracy in assembly process. The reason for the improvement of alignment capability comes from the fact that the camera of the assembly machine can see the image of the component, so it can be aligned before the assembly is completed.

In frontal technology, the camera is aligned to the contour of the component.

Using face-down technology, several components of different thickness can be embedded into the FR-4 core. The prepreg used for embedding is removed to form a cavity around the assembly. Prepregs with openings are stacked to the height of the assembly and are provided with non-openings at the top. By opening the dielectrics to various heights of the components, usually ranging from 100 to 350 um, it is easy to achieve different thickness embedding. Then, the embedded kernel can be used as the standard inner core and included in the PCB multi-layer structure. External SMD components can then be assembled on both sides of an embedded PCB to form very high-density modules/components (see Figure 2).

Embedded capacitors have many advantages, such as saving surface space, improving the product rate of device assembly, reducing power supply noise, reducing electromagnetic interference, simplifying circuit board design, and also raising higher challenges to equipment processing technology.

Company Features
1. Since inception, Rocket PCB Solution Ltd. has been active in developing, designing, and manufacturing . Today, we are one of the top suppliers in the industry.
2. We have a team of professional designers. They help the company craft the perfect design, integrating customers' brand into the visual aesthetic of products.
3. We strictly abide by environmental obligations. During our production, we ensure that our use of energy, raw material, and natural resources are totally legal and environmentally friendly.