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mixed hybrid pcb hybrid material for electronics

mixed hybrid pcb hybrid material for electronics

Mixed hybrid pcb hybrid material for electronics

Name:
Hybrid PCB, high frequency hybrid pcb
Material:
Rogers4350B/4330TM+FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
High frequency,embedded cu coin, RF line tolerance 7%, high frequency material
Payment:
L/C,T/T,Western Union,paypal
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Company Advantages
1. The material for Rocket PCB rf applications is carefully selected. Such properties and behaviors as strength, hardness, durability, flexibility, weight, resistance to heat and corrosion, electrical conductivity, and machinability are required. The software program arranges its parts for best performance
2. Rocket PCB Solution has established long-term strategic partnerships with several well-known brands of hybrid pcb . The product reduces the possibility of loose connections or short circuit
3. This product does not wrinkle or shrink even after many times of machine washing. And it does not pilling easily. It offers a simple platform to arrange the electronic components in a compressed way
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Rocket PCB deeply engaged in radio frequency field for many years, has very good experience in high frequency material characteristics, processing performance, process control, copper plating, lamination scheme, RF line tolerance, impedance parameter control, etc. Rocket PCB is your first choice for your RF PCB manufacturing.



LAMINATED STRUCTURE CONSIDERATIONS FOR HYBRID RF PCB

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Experience with the physical properties and equipment performance of laminates is critically important when producing printed circuit boards with different materials
Based on the CTE values of all material layers (e.g. FR4, PTFE and copper), each material grows at different rates under the thermal exposure during lamination, this can lead to significant registration problems. Because one material shrinks and the other expands, it can lead to the delamination of the interface between copper and the substrate. 

As a result, not all materials can be used in hybrid applications Working with PCB manufacturers in the early stages of the design process will provide you with the best results, as they know best which materials can work together optimally For example, Rogers 5880 is an excellent RF material for high-reliability applications. 

The biggest challenge for this material is that it will shrink after you etch the copper, so manufacturers need to understand how their technology work in the process to make up for the problem Hybrid structures typically include low-loss materials, such as Nelco or Rogers combined with core material such as FR-4 Common hybrid material types are also available, such as RO4350B+IT180A/370HR/NP175FR/TU768, F35/FR35A+FR4, TU-872+FR4, R-5775(M6)/R-5777/ R-5778 +FR4, RO3006/RO4360G2 +FR4, M4/M6 Nelco+IT180A etc.


THE CHALLENGE OF STACKING HYBRID MICROWAVE PCB

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One of the most difficult challenges in the stack-up of the hybrid board is consistently achieve overall thickness requirements for different products. Due to there are different material types, more than one prepreg (adhesive system) type can also be used to laminate the design together In many cases, non-flow FR-4 prepreg will be the best solution to maintain uniform thickness. Not all PCB manufacturers have exactly the same process, which is another important reason for early involvement in collaborative design with a high quality PCB manufacturer.


UNIQUE MECHANICAL PROPERTIES OF HIGH FREQUENCY PCB

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Usually the hybrid board also has several unique mechanical properties, which are difficult to be used in cost-effective manufacturing practices, include,


Strange Shape Board

Usually the RF PCB profile has many different twists and turns. This is a very sensitive process when dealing with hybrid designs. And some PTFE materials are very soft must slow down the feed speed.


Controll depth or internal cavity

Some of these features can be manufactured using multiple lamination,, while others must be done using a controlled depth routing process, usually a router bit or laser cutter. These challenges all increase the cost and complexity of high-speed/ hybrid PCB.


Through hole consistency

The traditional hole preparation before PTFE plating is different from that of FR4. Manufacturers must understand how processes affect hole wall quality. Because all materials have different densities and other characteristics, it is necessary to have a good experience in the control of hole copper quality, electroplating smoothness, cavity tolerances, hole wall cleanliness.



Now that you know how to make a decision, send us an RFQ. Rocket PCB has years of experience in RF field will help you get unparalleled quality printed circuit board.


PRODUCT APPLICATION
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Consumer electronics
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Automotive electronics
mixed hybrid pcb hybrid material for electronics-5                
Communications
mixed hybrid pcb hybrid material for electronics-6                
Energy
mixed hybrid pcb hybrid material for electronics-7                
Industrial & Instrumentation
mixed hybrid pcb hybrid material for electronics-8                
IOT/Smart Home
mixed hybrid pcb hybrid material for electronics-9                
Medical electronics
mixed hybrid pcb hybrid material for electronics-10                
Security Industry

Company Features
1. Over years of development, Rocket PCB Solution Ltd. has led to an enviable reputation as a manufacturer of rf applications . We have customers coming from countries in all 5 continents. They trust us and support our knowledge sharing process, bringing us market trends and relevant news in the global marketplaces, making us more capable of exploring the global market.
2. We have employed a design team. They deliver a specialized focus for the full range of a product’s life cycle and anticipate consumers' needs.
3. Our factory strength lies in a variety of flexible production facilities. They are well equipped with the latest technologies and comply with scientific management standards, which makes them meet a wide range of needs for manufacturing requirements. We have always been a pioneer in environmental issues. We have a comprehensive environmental program including production, distribution, and recycling. Inquiry!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!