More and more demands of high density, multi-function and miniaturization bring new challenges to packaging and substrate. Many new packaging technologies emerge as the times require, including embedded packaging technology. Embedded packaging technology is to embed passive components such as resistors, capacitors, inductors and even active components such as IC into PCB. This method can shorten the circuit length between components, improve the electrical characteristics, and also improve the effective PCB packaging area, reduce a large number of welding points on PCB board surface, thereby improving the reliability of packaging. It is an ideal high density packaging technology with low cost.
But at the same time the trend of packaging substrates is thin and miniaturized, requiring finer line spacing and smaller aperture, which presents a higher challenge for material selection, surface coating technology and fine trace making, fine soldermask making and other processes.
Rocket PCB can provide high density printed circuit board products with embedded passive components (thin core thickness less than 100 micron, embedded capacitance, resistance, inductance characteristics or integration of various embedded features). It mainly provides supporting services for high-end products such as communications, medical, consumer, military/aerospace and other high-end products.
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