Capabilities involved in PCB backplane design
Because the thickness of the backplane, size and is not the same as a conventional board, its performance requirements for the CCL is not the same
The thickness of the backplane is thicker than that of the conventional board
The size of the backplane is much larger, for production also has this certain impact
Due to the increase in thickness and the use of crimp contact, the accuracy of drilling and the ability to copper plating has special requirements
The number of layers
The layer of the backplane also be developed to the high-level number, more than 10 layers of design is also more common.
Backplane wiring density is relatively small, but there are special requirements for impedance requirements and inner-layer lines.
Due to the thickness of the backplane, size is relatively large, some surface treatment process is more difficult to achieve
Due to the characteristics of the backplane itself, the backplane sometimes uses some special processes.
◪ Panel sizes up to 54 inches
◪ Over 70 layers
◪ Blind and back drilled through holes
◪ Dual diameter holes
◪ Heavy copper layers
◪ Connector expertise
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