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stacked HDI PCB fabrication hdi production Rocket PCB

stacked HDI PCB fabrication hdi production Rocket PCB

stacked HDI PCB fabrication hdi production Rocket PCB

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Comparison
Closely following the market trend, Rocket PCB uses advanced production equipment and manufacturing technology to produce HDI PCB. The product receives favors from the majority of customers for the high quality and favorable price.Compared with other same kind of products in the market, Rocket PCB's HDI PCB is equipped with the following outstanding advantages.
  • product-Rocket PCB-stacked HDI PCB fabrication hdi production Rocket PCB-img
    stacked HDI PCB fabrication hdi production Rocket PCB-Rocket PCB-img-1
Company Advantages
1. All the processes of Rocket PCB pcb manufacturing process are conducted smoothly with advanced facility manned with highly qualified professionals.
2. pcb manufacturing process is HDI PCB fabrication, and is a guide for pcb prototyping industry.
3. pcb manufacturing process has won many trust and recognition from customers.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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application-stacked HDI PCB fabrication hdi production Rocket PCB-Rocket PCB-img-1
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


application-stacked HDI PCB fabrication hdi production Rocket PCB-Rocket PCB-img-1

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


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Consumer electronics
stacked HDI PCB fabrication hdi production Rocket PCB-PCB prototype-pcb fabrication-PCB maker-Rocket-1                
Automotive electronics
stacked HDI PCB fabrication hdi production Rocket PCB-pcb fabrication, PCB maker, PCB manufacturer-R-1                
Communications
stacked HDI PCB fabrication hdi production Rocket PCB-Rocket PCB-img-1                
Energy
stacked HDI PCB fabrication hdi production Rocket PCB-Rocket PCB-img-1                
Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
news-Rocket PCB-stacked HDI PCB fabrication hdi production Rocket PCB-img-1                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a global supplier and manufacturer of pcb manufacturing process with high quality.
2. Rocket PCB Solution Ltd. has an independent production base for various double layer pcb products development, production.
3. HDI PCB fabrication is Rocket PCB Solution Ltd. original service idea, which fully shows its own superiority. Get more info! Rocket PCB Solution Ltd. persists in the pcb prototyping service notion. Get more info!
Favorable rate
100%
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