Company Advantages
1. Our wire bonding technology are as superb quality as well as the leading brand products.
2. The wire bonding technology thus produced has features like semiconductor wire bonding .
3. wire bonding technology are recognized for their characteristics of semiconductor wire bonding .
4. This product can easily stand the market challenge and show a huge market prospect.

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. Rocket PCB Solution Ltd. is the first choice in high-end wire bonding technology industry.
2. The complete production and test equipment is owned by the Rocket PCB Solution factory.
3. Rocket PCB Solution Ltd. is committed to trust, honesty and responsibility, whether internal or external. Please contact. Rocket PCB Solution Ltd. is committed to producing the most valuable wire bonding process with less cost. Please contact. Rocket PCB Solution Ltd. takes customer's satisfaction as our ultimate goal. Please contact.