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challenges and techniques used in pcb fabrication process
by：Rocket PCB
2019-10-15
The printed circuit board is an independent electrical support model for surface mounting and packaging components in electrical equipment.
The importance and combination of the design, manufacture and customer needs of printed circuit boards play a vital role in developing the precise products specified by the customer.
The trend of full turnkey has been adopted in the market, from the control concept, design, surface installation or through
Hole technology, assembly, testing and delivery of orders to customers.
In order to maintain the quality and durability of the printed circuit board, international standards are followed.
This depends entirely on the type and level of design created for the prototype.
Challenges faced in manufacturing, such as lack of benchmarks (
Reference point)
, Polarity, hole size, label, proper panel, dry parts, over-hole in pad, large increment, heat dissipation, lead-free equipment, near equipment, trace cutting, proper finishing and clear laminated stacking depends entirely on the blueprint and design of the prototype.
Each product or prototype has a different layout depending on the space allocation.
There is software on the board that specifically designs the circuit model.
Then, arrange the raw materials according to the output, product type and product use.
Determine the quantity and quality of input according to circuit mode and model.
This is an important criterion for making the project cost-effective and quality.
With proper planning, design and adequate supply of raw materials, one can advance the PCB fab process.
For different types of PCB, there are different types of processes, such as two-
Single, single and multi-storey.
In order to start the manufacturing process, the glass fiber is rolled to a specific thickness according to the design.
By passing the substrate material to the oven, the substrate material is bent.
After that, place the layering of copper foil according to the size of the circuit board.
Drill holes on layers according to design and layout.
Copper is plated with the help of additives or subtraction processes.
The inner core, copper foil and pre-dip are combined with vacuum, heat or pressure to completely laminate them.
This is the time for multi-layer PCB manufacturing.
Copper plating creates a metal base on the holes and surfaces of the plate.
The outer layer is then coated with the same type of foil used for the inner coating in the middle of the board.
Tin plating is done to keep traces, pads and walls while operating on the outer layer.
The importance and combination of the design, manufacture and customer needs of printed circuit boards play a vital role in developing the precise products specified by the customer.
The trend of full turnkey has been adopted in the market, from the control concept, design, surface installation or through
Hole technology, assembly, testing and delivery of orders to customers.
In order to maintain the quality and durability of the printed circuit board, international standards are followed.
This depends entirely on the type and level of design created for the prototype.
Challenges faced in manufacturing, such as lack of benchmarks (
Reference point)
, Polarity, hole size, label, proper panel, dry parts, over-hole in pad, large increment, heat dissipation, lead-free equipment, near equipment, trace cutting, proper finishing and clear laminated stacking depends entirely on the blueprint and design of the prototype.
Each product or prototype has a different layout depending on the space allocation.
There is software on the board that specifically designs the circuit model.
Then, arrange the raw materials according to the output, product type and product use.
Determine the quantity and quality of input according to circuit mode and model.
This is an important criterion for making the project cost-effective and quality.
With proper planning, design and adequate supply of raw materials, one can advance the PCB fab process.
For different types of PCB, there are different types of processes, such as two-
Single, single and multi-storey.
In order to start the manufacturing process, the glass fiber is rolled to a specific thickness according to the design.
By passing the substrate material to the oven, the substrate material is bent.
After that, place the layering of copper foil according to the size of the circuit board.
Drill holes on layers according to design and layout.
Copper is plated with the help of additives or subtraction processes.
The inner core, copper foil and pre-dip are combined with vacuum, heat or pressure to completely laminate them.
This is the time for multi-layer PCB manufacturing.
Copper plating creates a metal base on the holes and surfaces of the plate.
The outer layer is then coated with the same type of foil used for the inner coating in the middle of the board.
Tin plating is done to keep traces, pads and walls while operating on the outer layer.
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